Inventor · disambiguated record
Il-Heung Choi
Also filed as: CHOI IL-HEUNG
8 granted patents·55 citations·filing 1998–2006
87Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD8
Top patents by PatentIndex Score
8 records- 0190US7453159B2Semiconductor chip having bond padsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 18, 2008·14 cites·24 claims
- 0286US7576440B2Semiconductor chip having bond pads and multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 18, 2009·9 cites·20 claims
- 0379US7541682B2Semiconductor chip having bond padsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 2, 2009·5 cites·14 claims
- 0476US7547977B2Semiconductor chip having bond padsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 16, 2009·4 cites·14 claims
- 0576US6642627B2Semiconductor chip having bond pads and multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 4, 2003·14 cites·28 claims
- 0652US7825523B2Semiconductor chip having bond padsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 2, 2010·0 cites·24 claims
- 0749US7148578B2Semiconductor multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 12, 2006·2 cites·28 claims
- 0837US6183589B1Method for manufacturing lead-on-chip (LOC) semiconductor packages using liquid adhesive applied under the leadsSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Feb 6, 2001·7 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →