Inventor · disambiguated record
Ilyoung Han
Also filed as: HAN ILYOUNG
12 granted patents·5 pending applications·39 citations·filing 2012–2024
86Inventor score
Top patents by PatentIndex Score
17 records- 0193US10923452B2Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 16, 2021·7 cites·20 claims
- 0288US9553069B2Bonding apparatus and substrate manufacturing equipment including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 24, 2017·10 cites·19 claims
- 0385US9245787B2Apparatus of manufacturing semiconductor packages and methods of manufacturing semiconductor packages using the sameJEON CHANG-SEONG·Filed 2012·Granted Jan 26, 2016·10 cites·18 claims
- 0479US11651990B2Substrate processing apparatus and driving method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 16, 2023·3 cites·15 claims
- 0576US12224262B2Substrate bonding apparatus and method of manufacturing semiconductor device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Feb 11, 2025·0 cites·10 claims
- 0676US9640507B2Bonding method, bonding apparatus, and method for manufacturing substrateHAN ILYOUNG·Filed 2014·Granted May 2, 2017·9 cites·8 claims
- 0768US2025249545A1Polishing process apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0867US11984345B2Substrate processing apparatus and driving method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 14, 2024·0 cites·3 claims
- 0961US11990444B2Substrate bonding apparatus and method of manufacturing semiconductor device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 21, 2024·0 cites·20 claims
- 1056US2025140588A1Die bonding apparatus and die bonding method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1155US2025219011A1Chuck for wafer bonding deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1253US2024170445A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1349US2024186282A1Die bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1447US11581202B2Substrate debonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·20 claims
- 1546US11462410B2Semiconductor manufacturing apparatus including a beam shaper for shaping a laser beamSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 4, 2022·0 cites·18 claims
- 1645US11942344B2Method of determining a critical temperature of a semiconductor package and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 26, 2024·0 cites·19 claims
- 1742US11430679B2Semiconductor manufacturing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 30, 2022·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →