Inventor · disambiguated record
Ilyoung Yoon
Also filed as: YOON ILYOUNG
14 granted patents·16 pending applications·27 citations·filing 2006–2025
86Inventor score
Files withSAMSUNG ELECTRONICS CO LTD30
Top patents by PatentIndex Score
30 records- 0188US7452817B2CMP method providing reduced thickness variationsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 18, 2008·18 cites·25 claims
- 0284US9006067B2Semiconductor device and method of fabricationg the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 14, 2015·7 cites·15 claims
- 0382US12207457B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jan 21, 2025·0 cites·20 claims
- 0473US11910594B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 0570US10535533B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 14, 2020·2 cites·20 claims
- 0669US12485515B2Slurry arm and chemical mechanical polishing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 2, 2025·0 cites·20 claims
- 0768US12328870B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 10, 2025·0 cites·18 claims
- 0868US2024227112A1Equipment, apparatus and method of chemical mechanical polishing (cmp)SAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0965US11411004B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 9, 2022·0 cites·20 claims
- 1063US2024341086A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1161US2025038110A1Integrated circuit devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1261US2025380498A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1361US2025234625A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1460US2025287688A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1559US2025142906A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1658US2025331168A1Semiconductor device having insulating structureSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1758US2024373621A1Method for manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1857US2025194215A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1956US2024014068A1Semiconductor device including interconnection structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2055US12501685B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·20 claims
- 2154US12490424B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·19 claims
- 2254US2024147697A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2353US12400907B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 2453US2024251544A1Semiconductor memory device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2549US2023201887A1Substrate cleaning device and substrate cleaning methodSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2648US12464795B2Method of manufacturing semiconductor device using single slurry chemical mechanical polishing (CMP) processSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·17 claims
- 2745US2025374561A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2843US11765880B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 19, 2023·0 cites·18 claims
- 2943US11757015B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·12 claims
- 3040US2014051246A1Methods of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →