Inventor · disambiguated record
In Seob Bae
Also filed as: BAE IN SEOB
14 granted patents·5 pending applications·7 citations·filing 2013–2024
84Inventor score
Files withHAESUNG DS CO LTD19
Top patents by PatentIndex Score
19 records- 0172US9460986B2Method of manufacturing semiconductor package substrate with limited use of film resist and semiconductor package substrate manufactured using the sameHAESUNG DS CO LTD·Filed 2015·Granted Oct 4, 2016·3 cites·9 claims
- 0270US9171789B2Lead frame, semiconductor package including the lead frame, and method of manufacturing the lead frameHAESUNG DS CO LTD·Filed 2013·Granted Oct 27, 2015·3 cites·16 claims
- 0368US10910299B2Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the method, and method of manufacturing semiconductor package and semiconductor package manufactured using the methodHAESUNG DS CO LTD·Filed 2018·Granted Feb 2, 2021·1 cites·18 claims
- 0461US11876012B2Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the sameHAESUNG DS CO LTD·Filed 2020·Granted Jan 16, 2024·0 cites·21 claims
- 0559US10840170B2Semiconductor package substrate and method for manufacturing sameHAESUNG DS CO LTD·Filed 2020·Granted Nov 17, 2020·0 cites·7 claims
- 0658US2025140661A1Lead frame, semiconductor package including the same, and method of manufacturing the lead frameHAESUNG DS CO LTD·Filed 2024·Application pending·0 cites
- 0755US12341086B2Lead frameHAESUNG DS CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·4 claims
- 0851US11854830B2Method of manufacturing circuit boardHAESUNG DS CO LTD·Filed 2020·Granted Dec 26, 2023·0 cites·19 claims
- 0951US10643932B2Semiconductor package substrate and method for manufacturing sameHAESUNG DS CO LTD·Filed 2016·Granted May 5, 2020·0 cites·11 claims
- 1048US2022274223A1Apparatus for grinding surface of substrateHAESUNG DS CO LTD·Filed 2022·Application pending·0 cites
- 1147US2022285251A1Semiconductor package substrate and method of manufacturing the same, and semiconductor package and method of manufacturing the sameHAESUNG DS CO LTD·Filed 2022·Application pending·0 cites
- 1247US2023080101A1Semiconductor package substrate, method of manufacturing the same, and semiconductor packageHAESUNG DS CO LTD·Filed 2022·Application pending·0 cites
- 1346US11227775B2Method of fabricating carrier for wafer level package by using lead frameHAESUNG DS CO LTD·Filed 2020·Granted Jan 18, 2022·0 cites·20 claims
- 1445US10811302B2Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the sameHAESUNG DS CO LTD·Filed 2018·Granted Oct 20, 2020·0 cites·10 claims
- 1544US12327728B2Method for manufacturing a pre-mold substrateHAESUNG DS CO LTD·Filed 2021·Granted Jun 10, 2025·0 cites·13 claims
- 1644US12249571B2Pre-mold substrate and method of manufacturing pre-mold substrateHAESUNG DS CO LTD·Filed 2021·Granted Mar 11, 2025·0 cites·16 claims
- 1744US10643933B2Semiconductor package substrate and manufacturing method thereforHAESUNG DS CO LTD·Filed 2016·Granted May 5, 2020·0 cites·9 claims
- 1841US2021107094A1Apparatus for and method of polishing surface of substrateHAESUNG DS CO LTD·Filed 2020·Application pending·0 cites
- 1935US10840161B2Method for manufacturing semiconductor package substrateHAESUNG DS CO LTD·Filed 2016·Granted Nov 17, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →