Inventor · disambiguated record
Inkeun Baek
Also filed as: BAEK INKEUN
9 granted patents·2 pending applications·1 citations·filing 2021–2024
74Inventor score
Files withSAMSUNG ELECTRONICS CO LTD11
Top patents by PatentIndex Score
11 records- 0180US12165933B2Semiconductor substrate processing apparatus and semiconductor substrate measuring apparatus using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 10, 2024·1 cites·20 claims
- 0271US12474260B2Terahertz signal measuring apparatus and measuring methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 0362US12474393B2Terahertz probeSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·17 claims
- 0462US12469750B2Method of extracting properties of a layer on a waferSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims
- 0561US11680898B2Hybrid probe, physical property analysis apparatus including the same, and method of measuring semiconductor device using the apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·17 claims
- 0661US2025003734A1Material measurement system and methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0757US12196669B2Inspection apparatus and method of inspecting waferSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·20 claims
- 0855US11946881B2Inspection apparatus and inspection method using sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 2, 2024·0 cites·20 claims
- 0955US11579168B2Probe for detecting near field and near-field detecting system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·20 claims
- 1055US11579167B2Probe for detecting near field and near-field detection system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·20 claims
- 1152US2024019362A1Probe and inspection apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →