Inventor · disambiguated record
Inhwa Baek
Also filed as: BAEK INHWA
0 granted patents·3 pending applications·0 citations·filing 2023–2024
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0149US2024242981A1Substrate bonding apparatus and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0246US2024153906A1Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0345US2024038536A1Plasma processing apparatus, wafer to wafer bonding system and wafer to wafer bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →