Inventor · disambiguated record
In Hak Baick
Also filed as: Baick In hak
0 granted patents·2 pending applications·0 citations·filing 2016–2018
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0132US2019214358A1Semiconductor device, semiconductor package including semiconductor device, and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 0226US2017136669A1Molding apparatus for semiconductor package fabrication and method of molding semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when In Hak Baick files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →