Inventor · disambiguated record
Ingo Bogen
Also filed as: BOGEN INGO
20 granted patents·58 citations·filing 2014–2023
92Inventor score
Files withSEMIKRON ELEKTRONIK GMBH & CO KG15SEMIKRON DANFOSS INT GMBH2SEMIKRON ELEKTRONIK GMBH2BAYERISCHE MOTOREN WERKE AG1
Top patents by PatentIndex Score
20 records- 0194US10090774B1Power electronic arrangement with DC voltage connection elementSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2018·Granted Oct 2, 2018·14 cites·12 claims
- 0291USD892754SPower moduleSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2020·Granted Aug 11, 2020·18 cites·1 claims
- 0389US11387588B2Power semiconductor module with press-fit contact elementSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2021·Granted Jul 12, 2022·2 cites·17 claims
- 0484US10163761B2Power semiconductor arrangementSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2015·Granted Dec 25, 2018·6 cites·14 claims
- 0579US10270358B2Power electronics submodule having DC and AC voltage terminal elements, and assembly hereofSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2018·Granted Apr 23, 2019·3 cites·16 claims
- 0675US9111900B2Power semiconductor device and method for producing a power semiconductor deviceSEMIKRON ELEKTRONIK GMBH·Filed 2014·Granted Aug 18, 2015·5 cites·15 claims
- 0772US10157806B2Power electronic submodule comprising a bipartite housingSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2016·Granted Dec 18, 2018·2 cites·23 claims
- 0863US9462708B2Power semiconductor deviceSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2015·Granted Oct 4, 2016·1 cites·10 claims
- 0960USD1078669SSemiconductor power module for vehiclesSEMIKRON DANFOSS INT GMBH·Filed 2023·Granted Jun 10, 2025·2 cites·1 claims
- 1055US12094797B2Pressing device for directly or indirectly applying pressure to power-semiconductor components of a power-semiconductor moduleSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2022·Granted Sep 17, 2024·0 cites·18 claims
- 1155US9392714B2Power semiconductor module and method of manufacturing a power semiconductorSEMIKRON ELEKTRONIK GMBH·Filed 2014·Granted Jul 12, 2016·1 cites·10 claims
- 1253US11742599B2Component for a vehicle electric drive, assembly for a vehicle electric drive, and method of electrically conductively connecting two componentsBAYERISCHE MOTOREN WERKE AG·Filed 2021·Granted Aug 29, 2023·0 cites·16 claims
- 1349US11533822B2Power electronics submodule for mounting on a cooling deviceSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2021·Granted Dec 20, 2022·0 cites·11 claims
- 1448US11800644B2Power electronic switching device, power semiconductor module therewith and method for productionSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2021·Granted Oct 24, 2023·0 cites·20 claims
- 1547US12362312B2Power semiconductor module having a substrate arrangement, having power semiconductor components and having a foil stack arrangementSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2022·Granted Jul 15, 2025·0 cites·10 claims
- 1646USD883241SPower moduleSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2018·Granted May 5, 2020·3 cites·1 claims
- 1743US11791740B2Power electronic arrangement with DC voltage connection element and method for its productionSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2021·Granted Oct 17, 2023·0 cites·12 claims
- 1842US10603741B2Apparatus for the material-bonded connection of connection partners of a power-electronics componentSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2016·Granted Mar 31, 2020·0 cites·17 claims
- 1935USD889423SPower moduleSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2018·Granted Jul 7, 2020·1 cites·1 claims
- 2023USD1078668SSemiconductor power module for vehiclesSEMIKRON DANFOSS INT GMBH·Filed 2023·Granted Jun 10, 2025·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →