Inventor · disambiguated record
In Sik Cho
Also filed as: CHO IN-SIK
7 granted patents·1 pending application·99 citations·filing 1991–2009
85Inventor score
Top patents by PatentIndex Score
8 records- 0170US8026601B2Encapsulated wafer level package with protection against damage and manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Sep 27, 2011·5 cites·23 claims
- 0257US5932923ASemiconductor device packages having dummy block leads and tie bars with extended portions to prevent formation of air traps in the encapsulateSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Aug 3, 1999·28 cites·16 claims
- 0354US5980870AHerb medicine extract-containing non-bleeding striped dentifrice compositionAEKYUNG IND CO LTD·Filed 1997·Granted Nov 9, 1999·21 cites·5 claims
- 0448US7906472B2Bleaching and detergent compositions comprising manganese complex prepared from tetra-aza macrocyclic ligands through a convenient synthesisAE KYUNG IND CO LTD·Filed 2006·Granted Mar 15, 2011·0 cites·1 claims
- 0548US5886405ASemiconductor device package having inner leads with slotsSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Mar 23, 1999·15 cites·10 claims
- 0646US5375162AMethod of making call connection in a private branch exchange system with paging systemSAMSUNG ELECTRONICS CO LTD·Filed 1991·Granted Dec 20, 1994·20 cites·8 claims
- 0746US2010013079A1Package substrate, semiconductor package having a package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 0840US5811132AMold for semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Sep 22, 1998·10 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →