Inventor · disambiguated record
Inhyo Hwang
Also filed as: HWANG INHYO
9 granted patents·10 pending applications·2 citations·filing 2020–2024
76Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD19
Top patents by PatentIndex Score
19 records- 0187US11329032B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 10, 2022·2 cites·20 claims
- 0277US12388024B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 0374US2025054915A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0465US12033948B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 0564US12159858B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·16 claims
- 0664US11784171B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 0763US12512446B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·19 claims
- 0860US2025046749A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0958US12446237B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 1057US12218100B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 1156US2025022843A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1256US2024222230A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1355US2024079340A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1454US12476179B2Semiconductor package including through-silicon via and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 1554US2024395719A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1654US2024063167A1Semiconductor package manufactured through a thermocompression process using a non-conductive film (ncf)SAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1754US2024040805A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1851US2023144602A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1949US2023005814A1Semiconductor package including heat sinksSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →