Inventor · disambiguated record
In-Ho Hyun
Also filed as: HYUN IN-HO
4 granted patents·86 citations·filing 1996–2000
78Inventor score
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0180US6287878B1Method of fabricating chip scale packageSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Sep 11, 2001·38 cites·18 claims
- 0259US5644247ATest socket and method for producing known good dies using the test socketSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Jul 1, 1997·34 cites·16 claims
- 0351US6618642B2Method, program storage device, and apparatus for optimizing and analyzing efficiency of equipmentSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Sep 9, 2003·4 cites·23 claims
- 0436US5940680AMethod for manufacturing known good die array having solder bumpsSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Aug 17, 1999·10 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →