Inventor · disambiguated record
In-Goo Kang
Also filed as: KANG IN-GOO
3 granted patents·1 pending application·31 citations·filing 2008–2018
68Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0189US7696004B2Wafer level package fabrication methodSAMSUNG ELECTRO MECH·Filed 2008·Granted Apr 13, 2010·23 cites·24 claims
- 0274US10894935B2Composition for removing silicone resins and method of thinning substrate by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 19, 2021·2 cites·20 claims
- 0367US8723304B2Semiconductor package and methods of fabricating the sameKANG IN-GOO·Filed 2009·Granted May 13, 2014·6 cites·22 claims
- 0435US2017158888A1Composition for removing silicone resins and method of thinning substrate by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →