Inventor · disambiguated record
In-Ku Kang
Also filed as: KANG IN K · KANG IN KU
41 granted patents·25 pending applications·784 citations·filing 2002–2024
97Inventor score
Files withSAMSUNG ELECTRONICS CO LTD31SK HYNIX INC31KANG IN-KU1KIM KYUNG MAN1SAMSUNG ELECTORNICS CO LTD1
Top patents by PatentIndex Score
66 records- 0197US6448661B1Three-dimensional multi-chip package having chip selection pads and manufacturing method thereofSAMSUNG ELECTORNICS CO LTD·Filed 2002·Granted Sep 10, 2002·420 cites·14 claims
- 0296US7098407B2Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrateSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Aug 29, 2006·100 cites·10 claims
- 0394US9129846B2Semiconductor package and method of formingSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 8, 2015·20 cites·17 claims
- 0494US8253232B2Package on package having a conductive post with height lower than an upper surface of an encapsulation layer to prevent circuit pattern lift defect and method of fabricating the sameKIM KYUNG-MAN·Filed 2010·Granted Aug 28, 2012·25 cites·10 claims
- 0593US11532641B2Semiconductor device with ferroelectricitySK HYNIX INC·Filed 2020·Granted Dec 20, 2022·2 cites·17 claims
- 0693US7282431B2Single chip and stack-type chip semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Oct 16, 2007·25 cites·13 claims
- 0791US9978693B2Integrated circuit package, method of fabricating the same, and wearable device including integrated circuit packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 22, 2018·9 cites·20 claims
- 0890US8890330B2Semiconductor packages and electronic systems including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Nov 18, 2014·10 cites·8 claims
- 0990US7485955B2Semiconductor package having step type die and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 3, 2009·30 cites·6 claims
- 1089US6977439B2Semiconductor chip stack structureSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Dec 20, 2005·55 cites·14 claims
- 1186US7368811B2Multi-chip package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 6, 2008·16 cites·23 claims
- 1283US11637124B2Stacked memory structure with insulating patternsSK HYNIX INC·Filed 2020·Granted Apr 25, 2023·1 cites·14 claims
- 1381US10581833B2Electronic device and method for processing secure informationSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 3, 2020·3 cites·16 claims
- 1481US10204869B2Integrated circuit package including shielding between adjacent chipsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 12, 2019·3 cites·22 claims
- 1581US2024422979A1Semiconductor device and manufacturing method of semiconductor deviceSK HYNIX INC·Filed 2024·Application pending·0 cites
- 1680US7521810B2Chip stack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 21, 2009·9 cites·14 claims
- 1780US2024431115A1Semiconductor device and manufacturing method of the semiconductor deviceSK HYNIX INC·Filed 2024·Application pending·0 cites
- 1877US12150307B2Semiconductor device and manufacturing method of the semiconductor deviceSK HYNIX INC·Filed 2022·Granted Nov 19, 2024·0 cites·13 claims
- 1975US12075623B2Method of forming a stacked memory structure with insulating patternsSK HYNIX INC·Filed 2023·Granted Aug 27, 2024·0 cites·6 claims
- 2074US12477959B2Resistive memory device and manufacturing method of the resistive memory deviceSK HYNIX INC·Filed 2022·Granted Nov 18, 2025·0 cites·10 claims
- 2173US12446234B2Resistive memory device and manufacturing method of the resistive memory deviceSK HYNIX INC·Filed 2022·Granted Oct 14, 2025·0 cites·12 claims
- 2272US12444464B2Resistive memory device and method of operating the resistive memory deviceSK HYNIX INC·Filed 2023·Granted Oct 14, 2025·0 cites·15 claims
- 2371US11778829B2Semiconductor device and manufacturing method of semiconductor deviceSK HYNIX INC·Filed 2022·Granted Oct 3, 2023·0 cites·9 claims
- 2470US8008765B2Semiconductor package having adhesive layer and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Aug 30, 2011·4 cites·17 claims
- 2570US2024038583A1Semiconductor device and manufacturing method of a semiconductor deviceSK HYNIX INC·Filed 2023·Application pending·0 cites
- 2669US12101935B2Semiconductor device and manufacturing method of semiconductor deviceSK HYNIX INC·Filed 2021·Granted Sep 24, 2024·0 cites·23 claims
- 2769US2025331180A1Memory device, method of manufacturing memory device, and method of operating memory deviceSK HYNIX INC·Filed 2024·Application pending·0 cites
- 2868US7176558B2Single chip and stack-type chip semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 13, 2007·12 cites·13 claims
- 2966US11804265B2Resistive memory device and method of operating the resistive memory deviceSK HYNIX INC·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
- 3066US6818976B2Bumped chip carrier package using lead frameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 16, 2004·12 cites·2 claims
- 3165US11430810B2Semiconductor device and manufacturing method of semiconductor deviceSK HYNIX INC·Filed 2020·Granted Aug 30, 2022·0 cites·13 claims
- 3264US2025040136A1Semiconductor memorySK HYNIX INC·Filed 2023·Application pending·0 cites
- 3363US7843051B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Nov 30, 2010·2 cites·16 claims
- 3463US2025056797A1Semiconductor device and method of manufacturing semiconductor deviceSK HYNIX INC·Filed 2023·Application pending·0 cites
- 3562US11817347B2Semiconductor device and manufacturing method of a semiconductor deviceSK HYNIX INC·Filed 2021·Granted Nov 14, 2023·0 cites·16 claims
- 3662US7067413B2Wire bonding method, semiconductor chip, and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jun 27, 2006·10 cites·14 claims
- 3762US2024324204A1Semiconductor memory device and method of manufacturing semiconductor memory deviceSK HYNIX INC·Filed 2023·Application pending·0 cites
- 3862US2025078942A1Method of operating a three-dimensional semiconductor memory deviceSK HYNIX INC·Filed 2024·Application pending·0 cites
- 3962US2024389323A1Semiconductor device and method of manufacturing the sameSK HYNIX INC·Filed 2023·Application pending·0 cites
- 4062US2025142821A1Semiconductor device and manufacturing method of semiconductor deviceSK HYNIX INC·Filed 2024·Application pending·0 cites
- 4161US10305883B2Electronic device and method for commonly using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 28, 2019·1 cites·15 claims
- 4259US11799028B2Semiconductor device and manufacturing method of semiconductor deviceSK HYNIX INC·Filed 2021·Granted Oct 24, 2023·0 cites·19 claims
- 4359US7030489B2Multi-chip module having bonding wires and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 18, 2006·8 cites·20 claims
- 4459US2024049465A1Semiconductor memory device and method of manufacturing the sameSK HYNIX INC·Filed 2023·Application pending·0 cites
- 4559US2024074169A1Semiconductor device and method of manufacturing the sameSK HYNIX INC·Filed 2023·Application pending·0 cites
- 4658US11800713B2Semiconductor device and manufacturing method of semiconductor deviceSK HYNIX INC·Filed 2021·Granted Oct 24, 2023·0 cites·13 claims
- 4757US11800714B2Semiconductor device and manufacturing method of semiconductor deviceSK HYNIX INC·Filed 2021·Granted Oct 24, 2023·0 cites·11 claims
- 4854US8178393B2Semiconductor package and manufacturing method thereofKANG IN-KU·Filed 2009·Granted May 15, 2012·1 cites·14 claims
- 4954US2024081060A1Semiconductor memory device and method of manufacturing the sameSK HYNIX INC·Filed 2023·Application pending·0 cites
- 5053US11437399B2Semiconductor device and manufacturing method of the semiconductor deviceSK HYNIX INC·Filed 2020·Granted Sep 6, 2022·0 cites·6 claims
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →