Inventor · disambiguated record
In-Yao Lee
Also filed as: LEE IN-YAO
10 granted patents·5 pending applications·36 citations·filing 2002–2006
86Inventor score
Files withBENQ CORP14
Top patents by PatentIndex Score
15 records- 0160US6530648B2Apparatus for using bubble as virtual valve to eject ink and fabricating method thereofBENQ CORP·Filed 2002·Granted Mar 11, 2003·8 cites·11 claims
- 0257US6789880B2Microinjector for jetting droplets of different sizesBENQ CORP·Filed 2002·Granted Sep 14, 2004·7 cites·29 claims
- 0354US7513042B2Method for fluid injectorBENQ CORP·Filed 2006·Granted Apr 7, 2009·1 cites·15 claims
- 0453US6733616B2Surface isolation deviceBENQ CORP·Filed 2002·Granted May 11, 2004·4 cites·17 claims
- 0547US7222945B2Fluid ejection apparatusBENQ CORP·Filed 2004·Granted May 29, 2007·4 cites·5 claims
- 0647US7089665B2Method for fabricating a monolithic fluid injection deviceBENQ CORP·Filed 2004·Granted Aug 15, 2006·2 cites·21 claims
- 0747US6824960B2Method of manufacturing a fluid injection deviceBENQ CORP·Filed 2003·Granted Nov 30, 2004·3 cites·20 claims
- 0847US6693045B2High density wafer production methodBENQ CORP·Filed 2002·Granted Feb 17, 2004·2 cites·20 claims
- 0945US6588878B2Jet and method thereof for ejecting droplets of different sizesBENQ CORP·Filed 2002·Granted Jul 8, 2003·3 cites·17 claims
- 1044US2006236537A1Method for fabricating a monolithic fluid injection deviceBENQ CORP·Filed 2006·Application pending·0 cites
- 1142US7040740B2Fluid injector and method of manufacturing the sameBENQ CORP·Filed 2003·Granted May 9, 2006·2 cites·22 claims
- 1241US2007024673A1Fluid ejection apparatusBENQ CORP·Filed 2006·Application pending·0 cites
- 1336US2005285906A1Fluid injection deviceBENQ CORP·Filed 2005·Application pending·0 cites
- 1435US2006170731A1Fluid injection device and method of fabricating the sameBENQ CORP·Filed 2005·Application pending·0 cites
- 1531US2002109753A1High density jetting a high density jetting apparatusFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →