Inventor · disambiguated record
In-Young Lee
Also filed as: LEE IN · LEE IN-YOUNG
71 granted patents·23 pending applications·568 citations·filing 1998–2024
99Inventor score
Files withSAMSUNG ELECTRONICS CO LTD66LEE IN YOUNG6DAE WOONG PHARMA2KOREA ELECTRIC POWER CORP2F1 SECURITY INC1
Top patents by PatentIndex Score
94 records- 0196US10333211B2Electronic device including multiband antennaSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 25, 2019·14 cites·20 claims
- 0295US12034204B2Antenna for wearable deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 9, 2024·2 cites·20 claims
- 0395US11476569B2Electronic device including multiband antennaSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 18, 2022·2 cites·20 claims
- 0495US10879597B2Antenna for wearable deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 29, 2020·10 cites·12 claims
- 0595US7015590B2Reinforced solder bump structure and method for forming a reinforced solder bumpSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 21, 2006·119 cites·18 claims
- 0694US11276921B2Electronic device including multiband antennaSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 15, 2022·2 cites·16 claims
- 0794US10020572B2Electronic device including multiband antennaSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 10, 2018·12 cites·19 claims
- 0894US9853012B2Semiconductor packages having through electrodes and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 26, 2017·12 cites·9 claims
- 0993US11949153B2Electronic device including multiband antennaSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 2, 2024·1 cites·20 claims
- 1092US7271084B2Reinforced solder bump structure and method for forming a reinforced solder bumpSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 18, 2007·26 cites·42 claims
- 1191US11081807B2Electronic device comprising array antennaSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 3, 2021·8 cites·20 claims
- 1291US11069968B2Electronic device including multiband antennaSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 20, 2021·2 cites·20 claims
- 1391US10727576B2Electronic device including multiband antennaSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 28, 2020·4 cites·20 claims
- 1491US10608323B2Electronic device including multi-band antennaSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 31, 2020·7 cites·19 claims
- 1591US10297909B2Antenna device and electronic device including sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 21, 2019·10 cites·15 claims
- 1691US9589930B2Semiconductor package including stepwise stacked chipsPARK CHUL·Filed 2014·Granted Mar 7, 2017·14 cites·16 claims
- 1791US9412707B2Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 9, 2016·8 cites·19 claims
- 1891US9165916B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 20, 2015·14 cites·13 claims
- 1990US9054228B2Semiconductor packages including a heat spreader and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 9, 2015·12 cites·20 claims
- 2089US9287140B2Semiconductor packages having through electrodes and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 15, 2016·9 cites·19 claims
- 2188US7307342B2Interconnection structure of integrated circuit chipSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 11, 2007·16 cites·19 claims
- 2286US12300883B2Electronic device including multiband antennaSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted May 13, 2025·0 cites·20 claims
- 2386US10871751B2Antenna for wearable deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 22, 2020·5 cites·18 claims
- 2486US10157883B2Semiconductor package including stepwise stacked chipsSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 18, 2018·5 cites·14 claims
- 2586US9245771B2Semiconductor packages having through electrodes and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 26, 2016·8 cites·30 claims
- 2686US9177942B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 3, 2015·9 cites·13 claims
- 2785US8362621B2Microelectronic devices including multiple through-silicon via structures on a conductive pad and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jan 29, 2013·14 cites·30 claims
- 2885US7602047B2Semiconductor device having through viasSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 13, 2009·13 cites·8 claims
- 2985US7205660B2Wafer level chip scale package having a gap and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 17, 2007·12 cites·10 claims
- 3084US10497675B2Semiconductor device including multiple semiconductor chipsKWAK BYOUNG SOO·Filed 2016·Granted Dec 3, 2019·7 cites·14 claims
- 3184US7777345B2Semiconductor device having through electrode and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 17, 2010·12 cites·12 claims
- 3282US11688931B2Antenna for wearable deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 27, 2023·1 cites·20 claims
- 3382US7545027B2Wafer level package having redistribution interconnection layer and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 9, 2009·11 cites·22 claims
- 3481US7592283B2Method of regenerating honeycomb type SCR catalyst by air lift loop reactorKOREA ELECTRIC POWER CORP·Filed 2005·Granted Sep 22, 2009·8 cites·3 claims
- 3579US8088648B2Method of manufacturing a chip stack packageJO CHA-JEA·Filed 2010·Granted Jan 3, 2012·6 cites·15 claims
- 3677US8415804B2Semiconductor chip, method of fabricating the same, and stack module and memory card including the sameLEE HO-JIN·Filed 2009·Granted Apr 9, 2013·7 cites·28 claims
- 3777US6504450B2Signal process apparatus for phase-shifting N number of signals inputted theretoKMW INC·Filed 2001·Granted Jan 7, 2003·17 cites·26 claims
- 3876US10767248B2Plastic deformation magnesium alloy having excellent thermal conductivity and flame retardancy, and preparation methodLEE IN YOUNG·Filed 2016·Granted Sep 8, 2020·1 cites·2 claims
- 3976US7312143B2Wafer level chip scale package having a gap and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 25, 2007·6 cites·10 claims
- 4075US10620669B2Electronic device including multiband antennaSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 14, 2020·2 cites·18 claims
- 4175US7592709B2Board on chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 22, 2009·5 cites·15 claims
- 4274US9171825B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 27, 2015·3 cites·22 claims
- 4374US7830017B2Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 9, 2010·6 cites·13 claims
- 4472US8026235B1Pyridyl benzoxazine derivatives, pharmaceutical composition comprising the same, and use thereofDAE WOONG PHARMA·Filed 2010·Granted Sep 27, 2011·3 cites·13 claims
- 4572US7897511B2Wafer-level stack package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Mar 1, 2011·4 cites·30 claims
- 4671US8941245B2Semiconductor package including semiconductor chip with through openingLEE CHANG-CHEOL·Filed 2012·Granted Jan 27, 2015·4 cites·19 claims
- 4771US8324733B2Semiconductor device comprising a through electrode and a pad connected to the through electrode and having an exposed portion and method for fabricating the sameLEE IN YOUNG·Filed 2010·Granted Dec 4, 2012·4 cites·11 claims
- 4870US6292304B1Apparatus for generating independent coherent beam arraySAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Sep 18, 2001·14 cites·5 claims
- 4969US7847416B2Wafer level package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Dec 7, 2010·3 cites·9 claims
- 5068US6616754B1Segregation reducing agent consisting of curdlan and alkaline solution and hydraulic composition containing the segregation reducing agentKOREA RES INST OF BIOSCIENCE·Filed 2000·Granted Sep 9, 2003·9 cites·6 claims
Showing the top 50 of 94 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →