Inventor · disambiguated record
Ingo Muri
Also filed as: MURI INGO
36 granted patents·8 pending applications·22 citations·filing 2013–2025
95Inventor score
Top patents by PatentIndex Score
44 records- 0192US10784161B2Semiconductor chip including self-aligned, back-side conductive layer and method for making the sameINFINEON TECHNOLOGIES AG·Filed 2018·Granted Sep 22, 2020·7 cites·8 claims
- 0287US11894445B2Method for producing a superjunction deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Feb 6, 2024·1 cites·14 claims
- 0383US10714377B2Semiconductor device and semiconductor wafer including a porous layer and method of manufacturingINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jul 14, 2020·3 cites·39 claims
- 0482US10325804B2Method of wafer thinning and realizing backside metal structuresINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 18, 2019·3 cites·22 claims
- 0580US2025366146A1Transistor device and method of manufacturingINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0679US11404262B2Method for partially removing a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 2, 2022·2 cites·24 claims
- 0778US12484242B2Method for producing a superjunction deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Granted Nov 25, 2025·0 cites·13 claims
- 0878US2024321953A1Superjunction transistor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0977US11139125B2Power relay circuitINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Oct 5, 2021·1 cites·11 claims
- 1077US11011409B2Devices with backside metal structures and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 18, 2021·1 cites·20 claims
- 1173US10199255B2Method for providing a planarizable workpiece support, a workpiece planarization arrangement, and a chuckINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 5, 2019·2 cites·20 claims
- 1272US9960076B2Devices with backside metal structures and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 1, 2018·1 cites·29 claims
- 1371US12034040B2Superjunction transistor device and method for forming a superjunction transistor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Jul 9, 2024·0 cites·9 claims
- 1469US11929395B2Superjunction transistor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Mar 12, 2024·0 cites·17 claims
- 1567US12176172B2Power relay circuitINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Dec 24, 2024·0 cites·13 claims
- 1667US11810779B2Method of porosifying part of a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2022·Granted Nov 7, 2023·0 cites·22 claims
- 1766US11652138B2Method for producing a superjunction deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted May 16, 2023·0 cites·15 claims
- 1866US2022270933A1Superjunction Transistor DeviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Application pending·0 cites
- 1965US12419096B2Transistor device and method of manufacturingINFINEON TECHNOLOGIES AG·Filed 2022·Granted Sep 16, 2025·0 cites·20 claims
- 2065US11328955B2Semiconductor chip including back-side conductive layerINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 10, 2022·0 cites·22 claims
- 2165US9472395B2Semiconductor arrangement including buried anodic oxide and manufacturing methodINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 18, 2016·1 cites·22 claims
- 2263US11348838B2Method for forming a superjunction transistor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted May 31, 2022·0 cites·13 claims
- 2361US12107130B2Semiconductor device having semiconductor device elements in a semiconductor layerINFINEON TECHNOLOGIES AG·Filed 2021·Granted Oct 1, 2024·0 cites·16 claims
- 2460US10535553B2Devices with backside metal structures and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jan 14, 2020·0 cites·14 claims
- 2559US11189690B2Method for forming a superjunction transistor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Nov 30, 2021·0 cites·8 claims
- 2656US11552048B2Semiconductor device including an electrical contact with a metal layer arranged thereonINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jan 10, 2023·0 cites·17 claims
- 2756US11038028B2Semiconductor device and manufacturing methodINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 15, 2021·0 cites·17 claims
- 2855US2025112097A1Semiconductor wafer including a test structureINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 2953US9627209B2Method for producing a semiconductorINFINEON TECHNOLOGIES AG·Filed 2016·Granted Apr 18, 2017·0 cites·20 claims
- 3053US9293330B2Method for producing a semiconductorINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 22, 2016·0 cites·13 claims
- 3153US2018330981A1Method for Thinning SubstratesINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 3251US10049914B2Method for thinning substratesINFINEON TECHNOLOGIES AG·Filed 2015·Granted Aug 14, 2018·0 cites·17 claims
- 3349US2021391377A1Method of thinning a semiconductor substrate to high evenness and semiconductor substrate having a device layer of high evennessINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 3448US10802404B2Reticle and exposure method including projection of a reticle pattern into neighboring exposure fieldsINFINEON TECHNOLOGIES AG·Filed 2018·Granted Oct 13, 2020·0 cites·11 claims
- 3548US10373839B2Wafer contacting device, and arrangement and method for electrochemical etching of a waferINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 6, 2019·0 cites·22 claims
- 3647US9683306B2Method of forming a composite material and apparatus for forming a composite materialINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 20, 2017·0 cites·14 claims
- 3746US10497583B2Method for manufacturing a semiconductor device comprising etching a semiconductor materialINFINEON TECHNOLOGIES AG·Filed 2018·Granted Dec 3, 2019·0 cites·18 claims
- 3846US2021391218A1Semiconductor device manufacturing by thinning and dicingINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 3943US10199372B2Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structuresINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 5, 2019·0 cites·25 claims
- 4042US10074566B2Semiconductor device and methods for forming a plurality of semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Sep 11, 2018·0 cites·32 claims
- 4142US9954065B2Method of forming a semiconductor device and semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Apr 24, 2018·0 cites·20 claims
- 4239US9862037B2Method for planarizing one or more workpieces, a workpiece planarization arrangement, a chuck and a replaceable workpiece-support for a chuckINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jan 9, 2018·0 cites·20 claims
- 4338US2018144982A1Semiconductor devices and methods for manufacturing semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 4437US9875926B2Substrates with buried isolation layers and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jan 23, 2018·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →