Inventor · disambiguated record
In-De Ou
Also filed as: OU IN-DE
7 granted patents·3 pending applications·325 citations·filing 2001–2008
88Inventor score
Files withADVANCED SEMICONDUCTOR ENG8
Top patents by PatentIndex Score
10 records- 0196US6680529B2Semiconductor build-up packageADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jan 20, 2004·154 cites·19 claims
- 0292US7586184B2Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Sep 8, 2009·29 cites·19 claims
- 0392US6701614B2Method for making a build-up package of a semiconductorADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Mar 9, 2004·89 cites·9 claims
- 0475US6750397B2Thermally enhanced semiconductor build-up packageADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jun 15, 2004·23 cites·11 claims
- 0573US7060595B2Circuit substrate and fabrication method thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jun 13, 2006·22 cites·14 claims
- 0672US7256480B2Lead frame package structure with high density of lead pins arrangementADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Aug 14, 2007·6 cites·7 claims
- 0762US8000107B2Carrier with embedded component and method for fabricating the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Aug 16, 2011·2 cites·20 claims
- 0835US2002189091A1Method of making printed circuit boardADVANCED SEMICONDUCTOR ENG·Filed 2001·Application pending·0 cites
- 0934US2002081771A1Flip chip processFiled 2001·Application pending·0 cites
- 1033US2002135059A1Chip packaging structureFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →