Inventor · disambiguated record
In-Keun Shim
Also filed as: SHIM IN K · SHIM IN-KEUN
7 granted patents·4 pending applications·67 citations·filing 2006–2010
82Inventor score
Top patents by PatentIndex Score
11 records- 0192US7785392B2Method for manufacturing metal nanoparticlesSAMSUNG ELECTRO MECH·Filed 2007·Granted Aug 31, 2010·28 cites·21 claims
- 0291US7858025B2Method for manufacturing cubic copper or copper oxide nanoparticlesSAMSUNG ELECTRO MECH·Filed 2007·Granted Dec 28, 2010·24 cites·17 claims
- 0384US7771624B2Nanoparticles, conductive ink and circuit line forming deviceSAMSUNG ELECTRO MECH·Filed 2006·Granted Aug 10, 2010·7 cites·4 claims
- 0478US7611644B2Core-shell structure metal nanoparticles and its manufacturing methodSAMSUNG ELECTRO MECH·Filed 2007·Granted Nov 3, 2009·8 cites·22 claims
- 0561US8343254B2Method of preparing composite nickel particlesSAMSUNG ELECTRO MECH·Filed 2009·Granted Jan 1, 2013·0 cites·5 claims
- 0656US2010108952A1Core-shell structure metal nanoparticles and its manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0752US2007098991A1Composite nickel particles and a preparing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 0850US8096263B2Nanoparticles, conductive ink and circuit line forming deviceSHIM IN-KEUN·Filed 2010·Granted Jan 17, 2012·0 cites·3 claims
- 0948US2008282537A1Wiring forming method of printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1045US2007092660A1Method and device for forming wiringSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1144US8173210B2Methods for surface modification of non-dispersible metal nanoparticles and modified metal nanoparticles for inkjet by the same methodSHIM IN-KEUN·Filed 2007·Granted May 8, 2012·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →