Inventor · disambiguated record
Inhyung Song
Also filed as: SONG INHYUNG
3 granted patents·13 pending applications·0 citations·filing 2021–2024
44Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD16
Top patents by PatentIndex Score
16 records- 0173US2025112193A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0268US2024170408A1Semiconductor package with stepped redistribution structure exposing mold layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0361US12482721B2Semiconductor package including heat dissipation structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 0461US12205914B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 21, 2025·0 cites·19 claims
- 0559US11887931B2Semiconductor package with stepped redistribution structure exposing mold layerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·18 claims
- 0656US2025062208A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0754US2024178122A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0854US2024088055A1Semiconductor package including alignment marksSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0954US2024096815A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1054US2024065002A1Semiconductor device and semiconductor package comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1152US2024203961A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1251US2024145375A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1349US2023361017A1Package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1448US2024047324A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1547US2023107492A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1647US2023071812A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →