Inventor · disambiguated record
Ingo Wennemuth
Also filed as: WENNEMUTH INGO
17 granted patents·1 pending application·160 citations·filing 2001–2008
93Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG13QIMONDA AG2GOSPODINOVA-DALTCHEVA MINKA1HETZEL WOLFGANG1SUBRAYA RAJESH1
Top patents by PatentIndex Score
18 records- 0183US7781900B2Semiconductor device comprising a housing and a semiconductor chip partly embedded in a plastic housing composition, and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2005·Granted Aug 24, 2010·14 cites·23 claims
- 0281US7342320B2Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assemblyINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 11, 2008·28 cites·12 claims
- 0380US8350364B2Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assemblyQIMONDA AG·Filed 2007·Granted Jan 8, 2013·8 cites·11 claims
- 0476US6768191B2Electronic component with stacked electronic elementsINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jul 27, 2004·24 cites·18 claims
- 0575US7253514B2Self-supporting connecting element for a semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2005·Granted Aug 7, 2007·7 cites·16 claims
- 0671US8624372B2Semiconductor component comprising an interposer substrateHETZEL WOLFGANG·Filed 2006·Granted Jan 7, 2014·6 cites·19 claims
- 0770US7294910B2Electronic component with multilayered rewiring plate and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2003·Granted Nov 13, 2007·16 cites·28 claims
- 0867US6703651B2Electronic device having stacked modules and method for producing itINFINEON TECHNOLOGIES AG·Filed 2001·Granted Mar 9, 2004·16 cites·27 claims
- 0966US6686648B2Electronic component with stacked semiconductor chips and method of producing the componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Feb 3, 2004·12 cites·13 claims
- 1061US7198979B2Method for manufacturing a stack arrangement of a memory moduleINFINEON TECHNOLOGIES AG·Filed 2003·Granted Apr 3, 2007·10 cites·27 claims
- 1157US6872594B2Method of fabricating an electronic componentINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 29, 2005·7 cites·13 claims
- 1250US7023097B2FBGA arrangementINFINEON TECHNOLOGIES AG·Filed 2004·Granted Apr 4, 2006·5 cites·23 claims
- 1350US6903932B2Covering element for subassembliesINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 7, 2005·4 cites·15 claims
- 1448US7345363B2Semiconductor device with a rewiring level and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Mar 18, 2008·1 cites·12 claims
- 1544US7500305B2Placement system for populating a substrate with electronic componentsQIMONDA AG·Filed 2006·Granted Mar 10, 2009·0 cites·18 claims
- 1644US7069647B2Method for populating a substrate with electronic componentsINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jul 4, 2006·2 cites·9 claims
- 1733US2007210433A1Integrated device having a plurality of chip arrangements and method for producing the sameSUBRAYA RAJESH·Filed 2006·Application pending·0 cites
- 1829US8143714B2Integrated circuit and method for producing the sameGOSPODINOVA-DALTCHEVA MINKA·Filed 2008·Granted Mar 27, 2012·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →