Inventor · disambiguated record
Iris Moder
Also filed as: MODER IRIS
23 granted patents·8 pending applications·13 citations·filing 2015–2025
91Inventor score
Files withINFINEON TECHNOLOGIES AG31
Top patents by PatentIndex Score
31 records- 0189US11476111B2Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2020·Granted Oct 18, 2022·2 cites·13 claims
- 0284US12412740B2Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2024·Granted Sep 9, 2025·0 cites·20 claims
- 0383US10714377B2Semiconductor device and semiconductor wafer including a porous layer and method of manufacturingINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jul 14, 2020·3 cites·39 claims
- 0482US10325804B2Method of wafer thinning and realizing backside metal structuresINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 18, 2019·3 cites·22 claims
- 0579US11404262B2Method for partially removing a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 2, 2022·2 cites·24 claims
- 0677US11881397B2Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jan 23, 2024·0 cites·20 claims
- 0777US11011409B2Devices with backside metal structures and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 18, 2021·1 cites·20 claims
- 0872US9960076B2Devices with backside metal structures and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 1, 2018·1 cites·29 claims
- 0967US11810779B2Method of porosifying part of a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2022·Granted Nov 7, 2023·0 cites·22 claims
- 1066US12249504B2Manufacturing and reuse of semiconductor substratesINFINEON TECHNOLOGIES AG·Filed 2022·Granted Mar 11, 2025·0 cites·29 claims
- 1166US2022246745A1Silicon Carbide Devices, Semiconductor Devices and Methods for Forming Silicon Carbide Devices and Semiconductor DevicesINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1266US2025183031A1Method of processing a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 1365US9472395B2Semiconductor arrangement including buried anodic oxide and manufacturing methodINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 18, 2016·1 cites·22 claims
- 1463US11342433B2Silicon carbide devices, semiconductor devices and methods for forming silicon carbide devices and semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 24, 2022·0 cites·15 claims
- 1561US12107130B2Semiconductor device having semiconductor device elements in a semiconductor layerINFINEON TECHNOLOGIES AG·Filed 2021·Granted Oct 1, 2024·0 cites·16 claims
- 1660US10535553B2Devices with backside metal structures and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jan 14, 2020·0 cites·14 claims
- 1756US11038028B2Semiconductor device and manufacturing methodINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 15, 2021·0 cites·17 claims
- 1853US2018330981A1Method for Thinning SubstratesINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 1951US10049914B2Method for thinning substratesINFINEON TECHNOLOGIES AG·Filed 2015·Granted Aug 14, 2018·0 cites·17 claims
- 2050US2025253168A1Apparatus for Electrochemical Treating of a Semiconductor Substrate and a Process using the ApparatusINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 2149US2021391377A1Method of thinning a semiconductor substrate to high evenness and semiconductor substrate having a device layer of high evennessINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 2248US10802404B2Reticle and exposure method including projection of a reticle pattern into neighboring exposure fieldsINFINEON TECHNOLOGIES AG·Filed 2018·Granted Oct 13, 2020·0 cites·11 claims
- 2346US10497583B2Method for manufacturing a semiconductor device comprising etching a semiconductor materialINFINEON TECHNOLOGIES AG·Filed 2018·Granted Dec 3, 2019·0 cites·18 claims
- 2446US2025239459A1Method of manufacturing a semiconductor device including a wide band gap semiconductor bodyINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 2546US2021391218A1Semiconductor device manufacturing by thinning and dicingINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 2644US11373857B2Semiconductor surface smoothing and semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 28, 2022·0 cites·18 claims
- 2743US10199372B2Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structuresINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 5, 2019·0 cites·25 claims
- 2842US10074566B2Semiconductor device and methods for forming a plurality of semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Sep 11, 2018·0 cites·32 claims
- 2942US9954065B2Method of forming a semiconductor device and semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Apr 24, 2018·0 cites·20 claims
- 3038US2018144982A1Semiconductor devices and methods for manufacturing semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 3137US9875926B2Substrates with buried isolation layers and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jan 23, 2018·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →