Inventor · disambiguated record
Isamu Kawashima
Also filed as: KAWASHIMA ISAMU
11 granted patents·4 pending applications·56 citations·filing 1998–2010
87Inventor score
Files withKAWASHIMA ISAMU5TOKYO SEIMITSU CO LTD4KAWABE TAKAO3MATSUSHITA ELECTRONICS CORP1SHIMIZU KOUJI1
Top patents by PatentIndex Score
15 records- 0176US8191370B2Engine with superchargerSHIMIZU KOUJI·Filed 2007·Granted Jun 5, 2012·10 cites·3 claims
- 0273US8151856B2Surface protection film peeling method and surface protection film peeling deviceKAWASHIMA ISAMU·Filed 2007·Granted Apr 10, 2012·6 cites·6 claims
- 0362US6805616B2Wafer planarization apparatus and planarization method thereofTOKYO SEIMITSU CO LTD·Filed 2002·Granted Oct 19, 2004·9 cites·2 claims
- 0461US6946311B2Processing apparatus and wafer processing methodTOKYO SEIMITSU CO LTD·Filed 2004·Granted Sep 20, 2005·8 cites·8 claims
- 0559US8402953B2EngineKAWABE TAKAO·Filed 2008·Granted Mar 26, 2013·4 cites·3 claims
- 0650US9488124B2Turbocharged engine with post fuel injection controlKAWABE TAKAO·Filed 2009·Granted Nov 8, 2016·3 cites·4 claims
- 0746US2007267132A1Tape adhering method and tape adhering deviceKAWASHIMA ISAMU·Filed 2007·Application pending·0 cites
- 0845US7490650B2Workpiece processing deviceTOKYO SEIMITSU CO LTD·Filed 2007·Granted Feb 17, 2009·0 cites·8 claims
- 0945US6127720ASemiconductor device and method for manufacturing the sameMATSUSHITA ELECTRONICS CORP·Filed 1998·Granted Oct 3, 2000·16 cites·3 claims
- 1043US8440040B2Tape adhering method and tape adhering deviceKAWASHIMA ISAMU·Filed 2010·Granted May 14, 2013·0 cites·3 claims
- 1139US8423266B2EngineKAWABE TAKAO·Filed 2009·Granted Apr 16, 2013·0 cites·19 claims
- 1239US7158910B2Device for calculating the quantity of light and method thereofTOKYO SEIMITSU CO LTD·Filed 2004·Granted Jan 2, 2007·0 cites·4 claims
- 1339US2007262276A1Cassette conveyance method and cassette conveyance apparatusKAWASHIMA ISAMU·Filed 2007·Application pending·0 cites
- 1439US2007284028A1Peeling tape adhering method and peeling tape adhering deviceKAWASHIMA ISAMU·Filed 2007·Application pending·0 cites
- 1537US2005118823A1Wafer processing method and wafer processing apparatusFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →