Inventor · disambiguated record
Istvan Novak
Also filed as: NOVAK ISTVAN
30 granted patents·1 pending application·660 citations·filing 1998–2024
97Inventor score
Top patents by PatentIndex Score
31 records- 0194US6104258ASystem and method for edge termination of parallel conductive planes in an electrical interconnecting apparatusSUN MICROSYSTEMS INC·Filed 1998·Granted Aug 15, 2000·116 cites·27 claims
- 0293US8152536B2Connection device for connection to a solar module and solar module comprising such connection deviceSCHERER HEINZ-PETER·Filed 2010·Granted Apr 10, 2012·35 cites·14 claims
- 0393US6215372B1Method and apparatus for reducing electrical resonances in power and noise propagation in power distribution circuits employing plane conductorsSUN MICROSYSTEMS INC·Filed 1999·Granted Apr 10, 2001·108 cites·24 claims
- 0489US10551417B2Inductor current measurement probeORACLE INT CORP·Filed 2017·Granted Feb 4, 2020·3 cites·20 claims
- 0585US6791846B2Power distribution system with a dedicated power structure and a high performance voltage regulatorSUN MICROSYSTEMS INC·Filed 2001·Granted Sep 14, 2004·32 cites·11 claims
- 0684US6923656B2Land grid array socket with diverse contactsSUN MICROSYSTEMS INC·Filed 2003·Granted Aug 2, 2005·33 cites·35 claims
- 0784US6215373B1Method for edge termination of parallel conductive planes including estimating the characteristic impedance of the structureSUN MICROSYSTEMS INC·Filed 1999·Granted Apr 10, 2001·61 cites·32 claims
- 0882US6870252B2Chip packaging and connection for reduced EMISUN MICROSYSTEMS INC·Filed 2003·Granted Mar 22, 2005·43 cites·26 claims
- 0980US6441313B1Printed circuit board employing lossy power distribution network to reduce power plane resonancesSUN MICROSYSTEMS INC·Filed 1999·Granted Aug 27, 2002·47 cites·12 claims
- 1079US2025107029A1Managing unwanted heat, mechanical stresses and emi in electrical connectors and printed circuit boardsSAMTEC INC·Filed 2024·Application pending·0 cites
- 1178US6753481B2Printed circuit board employing lossy power distribution network to reduce power plane resonancesSUN MICROSYSTEMS INC·Filed 2002·Granted Jun 22, 2004·21 cites·8 claims
- 1277US10564191B2Test tool for power distribution networksORACLE INT CORP·Filed 2017·Granted Feb 18, 2020·1 cites·20 claims
- 1376US6674338B2Adding electrical resistance in series with bypass capacitors to achieve a desired value of electrical impedance between conductors of an electrical power distribution structureSUN MICROSYSTEMS INC·Filed 2003·Granted Jan 6, 2004·18 cites·22 claims
- 1474US6525622B1Adding electrical resistance in series with bypass capacitors to achieve a desired value of electrical impedance between conducts of an electrical power distribution structureSUN MICROSYSTEMS INC·Filed 2000·Granted Feb 25, 2003·22 cites·6 claims
- 1573US6794581B2Method and apparatus for distributing power to integrated circuitsSUN MICROSYSTEMS INC·Filed 2001·Granted Sep 21, 2004·17 cites·22 claims
- 1673US6727774B1Bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure, and associated electrical power distribution structuresSUN MICROSYSTEMS INC·Filed 2000·Granted Apr 27, 2004·20 cites·34 claims
- 1771US6538461B2System and method for testing integrated passive components in a printed circuit boardSUN MICROSYSTEMS INC·Filed 2001·Granted Mar 25, 2003·18 cites·50 claims
- 1870US6606012B2Wideband bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structureSUN MICROSYSTEMS INC·Filed 2001·Granted Aug 12, 2003·15 cites·57 claims
- 1969US10126374B2Universal power distribution test tool and methodologyORACLE INT CORP·Filed 2016·Granted Nov 13, 2018·1 cites·20 claims
- 2069US7204701B1Method and apparatus for reducing capacitively coupled radio frequency energy between a semiconductor device and an adjacent metal structureSUN MICROSYSTEMS INC·Filed 2004·Granted Apr 17, 2007·18 cites·12 claims
- 2167US12207430B2Managing unwanted heat, mechanical stresses and EMI in electrical connectors and printed circuit boardsSAMTEC INC·Filed 2021·Granted Jan 21, 2025·0 cites·29 claims
- 2260US10768211B2System and method for current sense resistor compensationORACLE INT CORP·Filed 2018·Granted Sep 8, 2020·0 cites·20 claims
- 2358US6727780B2Adding electrical resistance in series with bypass capacitors using annular resistorsSUN MICROSYSTEMS INC·Filed 2001·Granted Apr 27, 2004·9 cites·36 claims
- 2455US7277841B1Method for adaptive sub-gridding for power/ground plane simulationsSUN MICROSYSTEMS INC·Filed 2003·Granted Oct 2, 2007·9 cites·32 claims
- 2553US6798640B1Capacitor having plates with a pattern void of conductive material and method of making therforSUN MICROSYSTEMS INC·Filed 2003·Granted Sep 28, 2004·6 cites·30 claims
- 2651US7969712B2Power integrity circuits with EMI benefitsORACLE AMERICA INC·Filed 2007·Granted Jun 28, 2011·0 cites·1 claims
- 2751US7162795B2Power distribution system with a dedicated power structure and a high performance voltage regulatorSUN MICROSYSTEMS INC·Filed 2004·Granted Jan 16, 2007·3 cites·15 claims
- 2845US8514549B2Power integrity circuits with EMI benefitsHOCKANSON DAVID·Filed 2011·Granted Aug 20, 2013·0 cites·8 claims
- 2945US6894230B2Printed circuit board employing lossy power distribution network to reduce power plane resonancesSUN MICROSYSTEMS INC·Filed 2004·Granted May 17, 2005·1 cites·6 claims
- 3045US6608257B1Direct plane attachment for capacitorsSUN MICROSYSTEMS INC·Filed 2001·Granted Aug 19, 2003·3 cites·44 claims
- 3126USD1087026SElectrical connectorSAMTEC INC·Filed 2022·Granted Aug 5, 2025·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →