Inventor · disambiguated record
Issei Okada
Also filed as: OKADA ISSEI
14 granted patents·15 pending applications·41 citations·filing 2004–2025
87Inventor score
Top patents by PatentIndex Score
29 records- 0191US7445731B2Metallic colloidal solution and inkjet-use metallic inkSUMITOMO ELECTRIC INDUSTRIES·Filed 2005·Granted Nov 4, 2008·22 cites·8 claims
- 0290US7608203B2Metallic colloidal solution and inkjet-use metallic inkSUMITOMO ELECTRIC INDUSTRIES·Filed 2008·Granted Oct 27, 2009·10 cites·8 claims
- 0380US10610928B2Powder for conductive material, ink for conductive material, conductive paste, and method for producing powder for conductive materialSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted Apr 7, 2020·1 cites·4 claims
- 0467US2016330850A1Method for producing printed wiring boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Application pending·0 cites
- 0561US7691175B2Granular metal powderSUMITOMO ELECTRIC INDUSTRIES·Filed 2004·Granted Apr 6, 2010·6 cites·6 claims
- 0659US2014166495A1Substrate for printed wiring board, printed wiring board, and methods for producing sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2014·Application pending·0 cites
- 0758US10307825B2Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powderSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted Jun 4, 2019·0 cites·6 claims
- 0858US2025328300A1Image processing apparatus and image processing methodCANON KK·Filed 2025·Application pending·0 cites
- 0956US2016330847A1Method for producing printed wiring boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Application pending·0 cites
- 1055US11013113B2Base material for printed circuit board and printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Granted May 18, 2021·0 cites·8 claims
- 1153US7510592B2Method of producing metal powderSUMITOMO ELECTRIC INDUSTRIES·Filed 2004·Granted Mar 31, 2009·2 cites·5 claims
- 1252US11752734B2Base material for printed circuit board and printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Granted Sep 12, 2023·0 cites·7 claims
- 1352US10796812B2Coating liquid for forming conductive layer, method for producing conductive layer, and conductive layerSUMITOMO ELECTRIC INDUSTRIES·Filed 2017·Granted Oct 6, 2020·0 cites·7 claims
- 1450US11465208B2Method of manufacturing copper nano-ink and copper nano-inkSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Granted Oct 11, 2022·0 cites·1 claims
- 1550US9967976B2Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted May 8, 2018·0 cites·10 claims
- 1650US2011141654A1Nickel powder or alloy powder comprising nickel as main component, method for producing the same, conductive paste and laminated ceramic capacitorSUMITOMO ELECTRIC INDUSTRIES·Filed 2009·Application pending·0 cites
- 1749US2012031656A1Substrate for printed wiring board, printed wiring board, and methods for producing sameOKA YOSHIO·Filed 2010·Application pending·0 cites
- 1847US8026185B2Method for manufacturing electronic circuit componentSUMITOMO ELECTRIC INDUSTRIES·Filed 2007·Granted Sep 27, 2011·0 cites·4 claims
- 1946US2011140162A1Conductive adhesive and led substrate using the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2009·Application pending·0 cites
- 2043US2018315519A1Coating liquid for forming conductive layer and method for manufacturing conductive layerSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Application pending·0 cites
- 2143US2018305829A1Method for manufacturing titanium trichloride solution and device for manufacturing titanium trichloride solutionSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Application pending·0 cites
- 2242US7285152B2Method of manufacturing chain-structure metal powderSUMITOMO ELECTRIC INDUSTRIES·Filed 2004·Granted Oct 23, 2007·0 cites·2 claims
- 2342US2025024596A1Substrate for printed wiring boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2022·Application pending·0 cites
- 2441US2006057502A1Method of forming a conductive wiring pattern by laser irradiation and a conductive wiring patternSUMITOMO ELECTRIC INDUSTRIES·Filed 2005·Application pending·0 cites
- 2541US2010208410A1Nickel powder or alloy powder having nickel as main component, method for manufacturing the powder, conductive paste and laminated ceramic capacitorOKADA ISSEI·Filed 2008·Application pending·0 cites
- 2640US2020344890A1Method of manufacturing substrate for printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Application pending·0 cites
- 2738US8507104B2Metal coating, forming method thereof, and metal wiringOKADA ISSEI·Filed 2006·Granted Aug 13, 2013·0 cites·6 claims
- 2838US2017213615A1Metal nanoparticle dispersion and metal coating filmSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Application pending·0 cites
- 2927US2015376535A1Water-slidable/oil-slidable film, production method thereof, and articles having the surface coated therewithDAIWA CAN COMPANYY·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Issei Okada files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →