Inventor · disambiguated record
Isao Ozawa
Also filed as: OZAWA ISAO
39 granted patents·12 pending applications·626 citations·filing 1976–2022
98Inventor score
Top patents by PatentIndex Score
51 records- 0195USD673921SPortion of a substrate for an electronic circuitTOSHIBA KK·Filed 2011·Granted Jan 8, 2013·75 cites·1 claims
- 0293US11424176B2Semiconductor device with sealed semiconductor chipKIOXIA CORP·Filed 2020·Granted Aug 23, 2022·2 cites·10 claims
- 0393USD778851SSubstrate for an electronic circuitTOSHIBA KK·Filed 2016·Granted Feb 14, 2017·32 cites·1 claims
- 0493USD673922SPortion of a substrate for an electronic circuitTOSHIBA KK·Filed 2011·Granted Jan 8, 2013·77 cites·1 claims
- 0593USD256557SPackaging containerAOBA SHIGYO COMPANY LTD·Filed 1978·Granted Aug 26, 1980·50 cites·1 claims
- 0692US4583723AElastically damping device for suspension of engineTOYODA GOSEI KK·Filed 1984·Granted Apr 22, 1986·52 cites·12 claims
- 0791US7339257B2Semiconductor device in which semiconductor chip is mounted on lead frameTOSHIBA KK·Filed 2005·Granted Mar 4, 2008·35 cites·18 claims
- 0888US8131912B2Memory systemOZAWA ISAO·Filed 2008·Granted Mar 6, 2012·21 cites·22 claims
- 0987USD778852SSubstrate for an electronic circuitTOSHIBA KK·Filed 2016·Granted Feb 14, 2017·20 cites·1 claims
- 1087USD257555SPackaging containerAOBA SHIGYO COMPANY LTD·Filed 1978·Granted Nov 25, 1980·22 cites·1 claims
- 1187US4079683AIndicating arrangement for use in sewing machinesJANOME SEWING MACHINE CO LTD·Filed 1976·Granted Mar 21, 1978·16 cites·11 claims
- 1286USD730304SSubstrate for an electronic circuitTOSHIBA KK·Filed 2014·Granted May 26, 2015·32 cites·1 claims
- 1385USD778850SSubstrate for an electronic circuitTOSHIBA KK·Filed 2016·Granted Feb 14, 2017·18 cites·1 claims
- 1484USD764424SSubstrate for an electronic circuitTOSHIBA KK·Filed 2014·Granted Aug 23, 2016·20 cites·1 claims
- 1583US4360549AMoldingTOYODA GOSEI KK·Filed 1981·Granted Nov 23, 1982·41 cites·12 claims
- 1682US9275947B2Semiconductor device and semiconductor package having a plurality of differential signal ballsTOSHIBA KK·Filed 2014·Granted Mar 1, 2016·6 cites·12 claims
- 1780US11854946B2Semiconductor device with sealed semiconductor chipKIOXIA CORP·Filed 2022·Granted Dec 26, 2023·0 cites·8 claims
- 1880US10297571B2Semiconductor packageTOSHIBA MEMORY CORP·Filed 2014·Granted May 21, 2019·5 cites·14 claims
- 1975US9704593B2Data storage device including nonvolatile memory in which on/off state of power source voltage is controlledTOSHIBA KK·Filed 2015·Granted Jul 11, 2017·2 cites·14 claims
- 2073US4635910AFluid-filled damper deviceTOYODA GOSEI KK·Filed 1985·Granted Jan 13, 1987·31 cites·3 claims
- 2169US10090235B2Semiconductor device and semiconductor packageTOSHIBA MEMORY CORP·Filed 2014·Granted Oct 2, 2018·2 cites·15 claims
- 2269US9688376B2Ballast water treatment system for shipSUMITOMO ELECTRIC INDUSTRIES·Filed 2013·Granted Jun 27, 2017·1 cites·1 claims
- 2368US7919837B2Semiconductor device with sealed semiconductor chipTOSHIBA KK·Filed 2006·Granted Apr 5, 2011·2 cites·20 claims
- 2467US9911502B2Data storage device with nonvolatile memoryTOSHIBA MEMORY CORP·Filed 2017·Granted Mar 6, 2018·2 cites·14 claims
- 2566US8970019B2Semiconductor device with sealed semiconductor chipOZAWA ISAO·Filed 2011·Granted Mar 3, 2015·1 cites·17 claims
- 2664US10872844B2Semiconductor device with sealed semiconductor chipTOSHIBA MEMORY CORP·Filed 2019·Granted Dec 22, 2020·0 cites·10 claims
- 2761US6791193B2Chip mounting substrate, first level assembly, and second level assemblyTOSHIBA KK·Filed 2003·Granted Sep 14, 2004·8 cites·20 claims
- 2860US6995320B2Wiring board and a packaging assembly using the sameTOSHIBA KK·Filed 2003·Granted Feb 7, 2006·11 cites·21 claims
- 2958US4492366AElastically damping device for the suspension of an engineTOYODA GOSEI KK·Filed 1982·Granted Jan 8, 1985·19 cites·10 claims
- 3055US10366942B2Semiconductor device with sealed semiconductor chipTOSHIBA MEMORY CORP·Filed 2015·Granted Jul 30, 2019·0 cites·15 claims
- 3155US9173293B2Memory module and video cameraNAGAHARA YASUYUKI·Filed 2012·Granted Oct 27, 2015·2 cites·16 claims
- 3253US7495329B2Semiconductor memory cardTOSHIBA KK·Filed 2007·Granted Feb 24, 2009·2 cites·12 claims
- 3352US10566274B2Semiconductor device and semiconductor package including plural solder ball sets each corresponding to a pair of differential input and differential output signalsTOSHIBA MEMORY CORP·Filed 2018·Granted Feb 18, 2020·0 cites·15 claims
- 3449US2016114269A1Filtering device, ballast water treatment method, and ballast water treatment apparatus using the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2014·Application pending·0 cites
- 3548US2010007014A1Semiconductor deviceTOSHIBA KK·Filed 2009·Application pending·0 cites
- 3646US2009026630A1Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2008·Application pending·0 cites
- 3744US2013319953A1Ballast water treatment apparatus and ballast water treatment methodOZAWA ISAO·Filed 2012·Application pending·0 cites
- 3844US2015336651A1Ballast water treatment apparatus and reverse cleaning method for ballast water treatment apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 2013·Application pending·0 cites
- 3943US9543271B2Semiconductor device having a sealing layer covering a semiconductor memory unit and a memory controllerTOSHIBA KK·Filed 2015·Granted Jan 10, 2017·0 cites·20 claims
- 4043USD473198SSemiconductor deviceTOSHIBA KK·Filed 2002·Granted Apr 15, 2003·5 cites·1 claims
- 4142US9087831B2Semiconductor module including first and second wiring portions separated from each otherOZAWA ISAO·Filed 2012·Granted Jul 21, 2015·0 cites·20 claims
- 4242US2005006747A1Chip mounting substrate, first level assembly, and second level assemblyTOSHIBA KK·Filed 2004·Application pending·0 cites
- 4342US2006145329A1Lead frame for semiconductor deviceTOSHIBA KK·Filed 2005·Application pending·0 cites
- 4442US2015200008A1Semiconductor package and electronic apparatusTOSHIBA KK·Filed 2014·Application pending·0 cites
- 4540US2017203239A1Water treatment method and water treatment deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Application pending·0 cites
- 4640US2012326338A1Semiconductor deviceEGUCHI TOYOKAZU·Filed 2012·Application pending·0 cites
- 4739US10409338B2Semiconductor device package having an oscillator and an apparatus having the sameTOSHIBA MEMORY CORP·Filed 2016·Granted Sep 10, 2019·0 cites·17 claims
- 4839US4925058ACup dispenserMIZUNO SANGYO CO LTD·Filed 1988·Granted May 15, 1990·14 cites·5 claims
- 4936US10204661B2Semiconductor deviceTOSHIBA MEMORY CORP·Filed 2015·Granted Feb 12, 2019·0 cites·9 claims
- 5033US2002130404A1Semiconductor module in which plural semiconductor chips are enclosed in one packageFiled 2002·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →