Inventor · disambiguated record
Iwao Ichikawa
Also filed as: ICHIKAWA IWAO
11 granted patents·1 pending application·265 citations·filing 1980–2005
92Inventor score
Top patents by PatentIndex Score
12 records- 0184US4451324AApparatus for placing chip type circuit elements on a boardSONY CORP·Filed 1980·Granted May 29, 1984·49 cites·12 claims
- 0275US5439161AThermocompression bonding apparatus, thermocompression bonding method and process of manufacturing liquid crystal display deviceSONY CORP·Filed 1994·Granted Aug 8, 1995·50 cites·9 claims
- 0373US5698068AThermocompression bonding equipmentSONY CORP·Filed 1995·Granted Dec 16, 1997·32 cites·11 claims
- 0473US4457451AApparatus for feeding electric circuit elementsSONY CORP·Filed 1981·Granted Jul 3, 1984·29 cites·4 claims
- 0568US4345371AMethod and apparatus for manufacturing hybrid integrated circuitsSONY CORP·Filed 1980·Granted Aug 24, 1982·26 cites·10 claims
- 0663US4460108AApparatus for feeding electric circuit elementsSONY CORP·Filed 1982·Granted Jul 17, 1984·22 cites·9 claims
- 0758US5568264AExterior view inspecting apparatus for circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Oct 22, 1996·23 cites·9 claims
- 0857US4336872AApparatus for transferring parts or the likeSONY CORP·Filed 1980·Granted Jun 29, 1982·19 cites·1 claims
- 0956US6618135B2Laser beam inspection apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Sep 9, 2003·1 cites·17 claims
- 1043US5787191AWiring pattern inspection apparatus for printed circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Jul 28, 1998·10 cites·1 claims
- 1140US2008248193A1Viscous Fluid Application DeviceNAKATSUJI HACHIROH·Filed 2005·Application pending·0 cites
- 1232US5459795AWiring pattern inspection apparatus for printed circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Oct 17, 1995·4 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →