Inventor · disambiguated record
Iwao Maekawa
Also filed as: MAEKAWA IWAO
22 granted patents·1 pending application·298 citations·filing 1977–2008
96Inventor score
Top patents by PatentIndex Score
23 records- 0192US4732702AElectroconductive resin pasteHITACHI CHEMICAL CO LTD·Filed 1987·Granted Mar 22, 1988·45 cites·13 claims
- 0278US6099678ALaminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1995·Granted Aug 8, 2000·61 cites·36 claims
- 0375US6991330B2Ink-jet recording material for proofMITSUBISHI PAPER MILLS LTD·Filed 2003·Granted Jan 31, 2006·13 cites·14 claims
- 0473US4370446AMethod for manufacture of polybutadiene-modified unsaturated polyesterHITACHI CHEMICAL CO LTD·Filed 1981·Granted Jan 25, 1983·26 cites·25 claims
- 0570US4224430AResinous compositionHITACHI CHEMICAL CO LTD·Filed 1977·Granted Sep 23, 1980·18 cites·18 claims
- 0670US4100120AResinous compositionHITACHI CHEMICAL CO LTD·Filed 1977·Granted Jul 11, 1978·20 cites·16 claims
- 0769US6825249B1Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2000·Granted Nov 30, 2004·17 cites·16 claims
- 0867US7387914B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2006·Granted Jun 17, 2008·2 cites·14 claims
- 0967US4228251AResin composition having low shrink propertiesHITACHI CHEMICAL CO LTD·Filed 1978·Granted Oct 14, 1980·16 cites·15 claims
- 1066US6717242B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Apr 6, 2004·12 cites·6 claims
- 1165US4338427AProcess for producing polyimide-amide-carboxylic acidHITACHI CHEMICAL CO LTD·Filed 1980·Granted Jul 6, 1982·15 cites·10 claims
- 1260US6855579B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Feb 15, 2005·6 cites·14 claims
- 1356US4233413AResin composition with low shrinkageHITACHI CHEMICAL CO LTD·Filed 1978·Granted Nov 11, 1980·13 cites·11 claims
- 1454US7781896B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2008·Granted Aug 24, 2010·0 cites·3 claims
- 1553US7057265B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2003·Granted Jun 6, 2006·3 cites·13 claims
- 1651US7326440B2Process for preparing an ink-jet recording materialMITSUBISHI PAPER MILLS LTD·Filed 2003·Granted Feb 5, 2008·0 cites·9 claims
- 1750US7078094B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jul 18, 2006·2 cites·27 claims
- 1850US4367314AResin compositionHITACHI CHEMICAL CO LTD·Filed 1981·Granted Jan 4, 1983·10 cites·16 claims
- 1948US4490496AMoistureproof insulating coating composition for packing circuit boardsHITACHI CHEMICAL CO LTD·Filed 1983·Granted Dec 25, 1984·12 cites·11 claims
- 2048US2003054145A1Sheet-state ink-jet recording materialFiled 2002·Application pending·0 cites
- 2147US7012320B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Mar 14, 2006·2 cites·42 claims
- 2235US4264754AOligomers and a method for the manufacture thereofHITACHI CHEMICAL CO LTD·Filed 1979·Granted Apr 28, 1981·3 cites·19 claims
- 2334US4245067AThermosetting resin compositionHITACHI CHEMICAL CO LTD·Filed 1979·Granted Jan 13, 1981·2 cites·9 claims
Join the waitlist — get patent alerts
Get an alert when Iwao Maekawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →