Inventor · disambiguated record
Izuru Komatsu
Also filed as: KOMATSU IZURU
16 granted patents·13 pending applications·238 citations·filing 1998–2023
92Inventor score
Top patents by PatentIndex Score
29 records- 0189US6186390B1Solder material and method of manufacturing solder materialTOSHIBA KK·Filed 1998·Granted Feb 13, 2001·67 cites·21 claims
- 0287US6386426B1Solder material and method of manufacturing solder materialTOSHIBA KK·Filed 2000·Granted May 14, 2002·35 cites·15 claims
- 0384US7604154B2Thermosetting flux and solder pasteTOSHIBA KK·Filed 2007·Granted Oct 20, 2009·10 cites·9 claims
- 0483US6123248ASoldering method and soldering apparatusTOSHIBA KK·Filed 1998·Granted Sep 26, 2000·44 cites·9 claims
- 0581US6464122B1Soldering method and soldering apparatusKURODA TECHNO CO LTD·Filed 2000·Granted Oct 15, 2002·30 cites·5 claims
- 0674US11795317B2Laminated body including resin body and gel body and method for producing sameUNIV OSAKA·Filed 2022·Granted Oct 24, 2023·0 cites·7 claims
- 0773US6673310B2Solder material, device using the same and manufacturing process thereofTOSHIBA KK·Filed 2000·Granted Jan 6, 2004·19 cites·11 claims
- 0866US6220501B1Method of joining metallic members, and joined metallic membersTOSHIBA KK·Filed 1998·Granted Apr 24, 2001·30 cites·25 claims
- 0965US10912193B2Structure, wiring board, substrate for wiring board, copper clad laminate, and method for manufacturing the structureTOSHIBA KK·Filed 2020·Granted Feb 2, 2021·0 cites·10 claims
- 1056US2024312947A1Semiconductor deviceTOSHIBA KK·Filed 2023·Application pending·0 cites
- 1155US11229129B2Housing, electronic device, method for manufacturing housing, and method for manufacturing electronic deviceTOSHIBA KK·Filed 2020·Granted Jan 18, 2022·0 cites·16 claims
- 1254US8039857B2Optical semiconductor device and method of manufacturing optical semiconductor deviceTOSHIBA KK·Filed 2009·Granted Oct 18, 2011·0 cites·6 claims
- 1350US8643264B2Illuminating deviceTOSHIBA KK·Filed 2012·Granted Feb 4, 2014·0 cites·6 claims
- 1450US8618723B2LuminaireSAKAI MAKOTO·Filed 2012·Granted Dec 31, 2013·0 cites·20 claims
- 1548US12107023B2Power moduleTOSHIBA KK·Filed 2021·Granted Oct 1, 2024·0 cites·10 claims
- 1648US6949814B2Mounting material, semiconductor device and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2002·Granted Sep 27, 2005·3 cites·12 claims
- 1747US2010006888A1Method of manufacturing optical semiconductor device, optical semiconductor device, and method of manufacturing optical semiconductor apparatusTOSHIBA KK·Filed 2009·Application pending·0 cites
- 1846US8241937B2Optical semiconductor device and method of manufacturing optical semiconductor deviceHAPPOYA AKIHIKO·Filed 2011·Granted Aug 14, 2012·0 cites·2 claims
- 1946US2006067853A1Lead free solderTOSHIBA KK·Filed 2005·Application pending·0 cites
- 2046US2015077993A1Lighting apparatusTOSHIBA KK·Filed 2014·Application pending·0 cites
- 2145US2014003057A1Lighting DeviceTOSHIBA KK·Filed 2013·Application pending·0 cites
- 2244US2012218737A1Lighting apparatusKOMATSU IZURU·Filed 2012·Application pending·0 cites
- 2343US2008073794A1Semiconductor apparatus and fabrication method thereofTOSHIBA KK·Filed 2007·Application pending·0 cites
- 2442US2005056687A1Thermosetting flux and solder pasteTOSHIBA KK·Filed 2004·Application pending·0 cites
- 2541US2012212959A1Lighting deviceINOUE MICHINOBU·Filed 2012·Application pending·0 cites
- 2640US2006081995A1Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2005·Application pending·0 cites
- 2740US2005218525A1Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2005·Application pending·0 cites
- 2839US2004096688A1Lead-free joining material and joining method using the sameTOSHIBA KK·Filed 2003·Application pending·0 cites
- 2938US2013063957A1Lighting device and manufacturing method thereofSAKAI MAKOTO·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →