Inventor · disambiguated record
Jae In Ahn
Also filed as: AHN JAE IN
7 granted patents·6 pending applications·0 citations·filing 2017–2024
67Inventor score
Top patents by PatentIndex Score
13 records- 0169US2025018526A1Polishing pad, preparation method thereof and method for preparing semiconductor device using sameSK ENPULSE CO LTD·Filed 2024·Application pending·0 cites
- 0262US2022203496A1Polishing pad, manufacturing method thereof, method for manufacturing semiconductor device using sameSKC SOLMICS CO LTD·Filed 2021·Application pending·0 cites
- 0361US12138738B2Polishing pad, preparation method thereof and method for preparing semiconductor device using sameSK ENPULSE CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·16 claims
- 0455US12042900B2Polishing system, polishing pad and method of manufacturing semiconductor deviceSK ENPULSE CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·17 claims
- 0552US11759909B2Polishing pad, preparation method thereof and method for preparing semiconductor device using sameSK ENPULSE CO LTD·Filed 2021·Granted Sep 19, 2023·0 cites·20 claims
- 0651US2023047113A1Polishing device and method for manufacturing semiconductor deviceSKC SOLMICS CO LTD·Filed 2022·Application pending·0 cites
- 0750US2023052322A1Polishing pad and method for manufacturing semiconductor device using sameSKC SOLMICS CO LTD·Filed 2022·Application pending·0 cites
- 0849US12162114B2Polishing pad, manufacturing method thereof and preparing method of semiconductor device using the sameSK ENPULSE CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·17 claims
- 0949US12138736B2Polishing pad sheet, polishing pad, and method for manufacturing semiconductor deviceSK ENPULSE CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·20 claims
- 1049US11951591B2Polishing pad, method for producing the same and method of fabricating semiconductor device using the sameSK ENPULSE CO LTD·Filed 2021·Granted Apr 9, 2024·0 cites·10 claims
- 1149US11326030B2Colorless and transparent polyamide-imide film, and manufacturing method thereforSKC CO LTD·Filed 2017·Granted May 10, 2022·0 cites·5 claims
- 1249US2023059394A1Polishing pad and method for manufacturing semiconductor device using the sameSKC SOLMICS CO LTD·Filed 2022·Application pending·0 cites
- 1348US2022371155A1Polishing pad, manufacturing method thereof, method for manufacturing semiconductor device using sameSKC SOLMICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →