Inventor · disambiguated record
Jae Yong An
Also filed as: AN JAE YONG
2 granted patents·3 pending applications·4 citations·filing 2007–2024
46Inventor score
Top patents by PatentIndex Score
5 records- 0165US7745308B2Method of fabricating micro-vertical structureKOREA ELECTRONICS TELECOMM·Filed 2009·Granted Jun 29, 2010·3 cites·9 claims
- 0262US10157873B1Semiconductor package including bumpSK HYNIX INC·Filed 2017·Granted Dec 18, 2018·1 cites·23 claims
- 0358US2025239543A1Semiconductor device and semiconductor package with redistribution lineSK HYNIX INC·Filed 2024·Application pending·0 cites
- 0454US2025239550A1Semiconductor device, semiconductor package with redistribution line, and method of forming semiconductor deviceSK HYNIX INC·Filed 2024·Application pending·0 cites
- 0536US2008081398A1Cap Wafer for Wafer Bonded Packaging and Method for Manufacturing the SameFIONIX INC·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →