Inventor · disambiguated record
James Raymond Maliclic Baello
Also filed as: BAELLO JAMES R M · BAELLO JAMES RAYMOND · BAELLO JAMES RAYMOND MALICLIC
12 granted patents·4 pending applications·15 citations·filing 2005–2025
85Inventor score
Files withTEXAS INSTRUMENTS INC16
Top patents by PatentIndex Score
16 records- 0180US2025289711A1Semiconductor package with metal column mold barrierTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0279US10593640B2Flip chip integrated circuit packages with spacersTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 17, 2020·3 cites·21 claims
- 0373US12506054B2Electronic device topside coolingTEXAS INSTRUMENTS INC·Filed 2023·Granted Dec 23, 2025·0 cites·21 claims
- 0472US9219052B2Making a flip-chip assembly with bond fingersTEXAS INSTRUMENTS INC·Filed 2014·Granted Dec 22, 2015·3 cites·8 claims
- 0572US2025022841A1Semiconductor device assembly with pre-reflowed solderTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0671US12319563B2Semiconductor package with metal column mold barrierTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 3, 2025·0 cites·15 claims
- 0771US8381967B1Bonding a solder bump to a lead using compression and retraction forcesTEXAS INSTRUMENTS INC·Filed 2012·Granted Feb 26, 2013·3 cites·19 claims
- 0871US2023187223A1Semiconductor package with flip chip solder joint capsulesTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0966US8766461B1Substrate with bond fingersTEXAS INSTRUMENTS INC·Filed 2013·Granted Jul 1, 2014·2 cites·11 claims
- 1061US12132027B2Semiconductor device assembly with pre-reflowed solderTEXAS INSTRUMENTS INC·Filed 2020·Granted Oct 29, 2024·0 cites·26 claims
- 1157US11742266B2Electronic device topside coolingTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 29, 2023·0 cites·23 claims
- 1256US11600498B2Semiconductor package with flip chip solder joint capsulesTEXAS INSTRUMENTS INC·Filed 2019·Granted Mar 7, 2023·0 cites·26 claims
- 1355US9564410B2Semiconductor devices having metal bumps with flangeTEXAS INSTRUMENTS INC·Filed 2015·Granted Feb 7, 2017·1 cites·20 claims
- 1455US7462943B2Semiconductor assembly for improved device warpage and solder ball coplanarityTEXAS INSTRUMENTS INC·Filed 2007·Granted Dec 9, 2008·2 cites·7 claims
- 1552US7244636B2Semiconductor assembly for improved device warpage and solder ball coplanarityTEXAS INSTRUMENTS INC·Filed 2005·Granted Jul 17, 2007·1 cites·6 claims
- 1636US2008188016A1Die detection and reference die wafermap alignmentTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →