Inventor · disambiguated record
Jamie A. Bayan
Also filed as: BAYAN JAMIE A
1 granted patent·1 pending application·21 citations·filing 2004–2010
40Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0170US7259460B1Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit packageNAT SEMICONDUCTOR CORP·Filed 2004·Granted Aug 21, 2007·21 cites·7 claims
- 0231US2012074561A1Backmetal replacement for use in the packaging of integrated circuitsTU NGHIA T·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →