Inventor · disambiguated record
James E. Benedict
Also filed as: BENEDICT JAMES · BENEDICT JAMES E
35 granted patents·7 pending applications·46 citations·filing 2018–2023
95Inventor score
Files withRAYTHEON CO42
Top patents by PatentIndex Score
42 records- 0195US10826147B2Radio frequency circuit with a multi-layer transmission line assembly having a conductively filled trench surrounding the transmission lineRAYTHEON CO·Filed 2018·Granted Nov 3, 2020·18 cites·14 claims
- 0289US10631405B1Additive manufacturing technology (AMT) inverted pad interfaceRAYTHEON CO·Filed 2019·Granted Apr 21, 2020·8 cites·19 claims
- 0388US10839992B1Thick film resistors having customizable resistances and methods of manufactureRAYTHEON CO·Filed 2019·Granted Nov 17, 2020·5 cites·20 claims
- 0487US10999938B1Method of wire bonding a first and second circuit cardRAYTHEON CO·Filed 2020·Granted May 4, 2021·3 cites·5 claims
- 0586US11122692B1Preparation of solder bump for compatibility with printed electronics and enhanced via reliabilityRAYTHEON CO·Filed 2020·Granted Sep 14, 2021·2 cites·12 claims
- 0681US11121474B2Additive manufacturing technology (AMT) low profile radiatorRAYTHEON CO·Filed 2018·Granted Sep 14, 2021·2 cites·6 claims
- 0778US10813210B2Radio frequency circuit comprising at least one substrate with a conductively filled trench therein for electrically isolating a first circuit portion from a second circuit portionRAYTHEON CO·Filed 2018·Granted Oct 20, 2020·2 cites·17 claims
- 0877US12398704B2Thermally-enhanced and deployable structuresRAYTHEON CO·Filed 2019·Granted Aug 26, 2025·2 cites·21 claims
- 0974US11482795B2Segmented patch phased array radiatorRAYTHEON CO·Filed 2020·Granted Oct 25, 2022·1 cites·17 claims
- 1074US11089687B2Additive manufacturing technology (AMT) low profile signal dividerRAYTHEON CO·Filed 2019·Granted Aug 10, 2021·2 cites·9 claims
- 1172US10849219B2SNAP-RF interconnectionsRAYTHEON CO·Filed 2019·Granted Nov 24, 2020·1 cites·4 claims
- 1272US2023121347A1Additive manufacturing technology microwave vertical launchRAYTHEON CO·Filed 2022·Application pending·0 cites
- 1372US2023209728A1Method for forming channels in printed circuit boards by stacking slotted layersRAYTHEON CO·Filed 2023·Application pending·0 cites
- 1470US12021306B2Low profile phased arrayRAYTHEON CO·Filed 2021·Granted Jun 25, 2024·0 cites·8 claims
- 1570US11632856B2Wall for isolation enhancementRAYTHEON CO·Filed 2021·Granted Apr 18, 2023·0 cites·7 claims
- 1669US11581652B2Spiral antenna and related fabrication techniquesRAYTHEON CO·Filed 2022·Granted Feb 14, 2023·0 cites·13 claims
- 1768US11375609B2Method of manufacturing radio frequency interconnectionsRAYTHEON CO·Filed 2020·Granted Jun 28, 2022·0 cites·8 claims
- 1867US11470725B2Method for fabricating Z-axis vertical launchRAYTHEON CO·Filed 2021·Granted Oct 11, 2022·0 cites·8 claims
- 1967US11107610B2Thick film resistors having customizable resistances and methods of manufactureRAYTHEON CO·Filed 2020·Granted Aug 31, 2021·0 cites·20 claims
- 2067US2021400820A1Preparation of solder bump for compatibility with printed electronics and enhanced via reliabilityRAYTHEON CO·Filed 2021·Application pending·0 cites
- 2162US12444818B2Monolithic waveguide and supporting waveguide bridgeRAYTHEON CO·Filed 2022·Granted Oct 14, 2025·0 cites·11 claims
- 2262US11089673B2Wall for isolation enhancementRAYTHEON CO·Filed 2019·Granted Aug 10, 2021·0 cites·6 claims
- 2360US12512574B2Waveguide components of waveguides formed with additive manufacturingRAYTHEON CO·Filed 2022·Granted Dec 30, 2025·0 cites·7 claims
- 2460US11606865B2Method for forming channels in printed circuit boards by stacking slotted layersRAYTHEON CO·Filed 2019·Granted Mar 14, 2023·0 cites·8 claims
- 2560US11497118B2Method for manufacturing non-planar arrays with a single flex-hybrid circuit cardRAYTHEON CO·Filed 2021·Granted Nov 8, 2022·0 cites·19 claims
- 2660US11289814B2Spiral antenna and related fabrication techniquesRAYTHEON CO·Filed 2018·Granted Mar 29, 2022·0 cites·4 claims
- 2759US11145952B2Advanced communications arrayRAYTHEON CO·Filed 2019·Granted Oct 12, 2021·0 cites·13 claims
- 2859US11109489B2Apparatus for fabricating Z-axis vertical launch within a printed circuit boardRAYTHEON CO·Filed 2019·Granted Aug 31, 2021·0 cites·13 claims
- 2956US11158955B2Low profile phased arrayRAYTHEON CO·Filed 2018·Granted Oct 26, 2021·0 cites·10 claims
- 3056US2019150296A1Additive manufacturing technology microwave vertical launchRAYTHEON CO·Filed 2018·Application pending·0 cites
- 3155US11317502B2PCB cavity mode suppressionRAYTHEON CO·Filed 2020·Granted Apr 26, 2022·0 cites·18 claims
- 3254US11171101B2Process for removing bond film from cavities in printed circuit boardsRAYTHEON CO·Filed 2020·Granted Nov 9, 2021·0 cites·20 claims
- 3352US11145977B2Interlocking modular beamformerRAYTHEON CO·Filed 2019·Granted Oct 12, 2021·0 cites·16 claims
- 3451US12266629B2Ball bond impedance matchingRAYTHEON CO·Filed 2021·Granted Apr 1, 2025·0 cites·13 claims
- 3551US11569574B2Millimeter wave phased arrayRAYTHEON CO·Filed 2019·Granted Jan 31, 2023·0 cites·17 claims
- 3651US11444365B2Radio-frequency (RF)-interface and modular plateRAYTHEON CO·Filed 2020·Granted Sep 13, 2022·0 cites·16 claims
- 3750US11890676B2Waveguide fence supportRAYTHEON CO·Filed 2021·Granted Feb 6, 2024·0 cites·16 claims
- 3844US2021066830A1Stripline edge snap radio-frequency connectionRAYTHEON CO·Filed 2019·Application pending·0 cites
- 3943US2020367357A1Flat-wire copper vertical launch microwave interconnection methodRAYTHEON CO·Filed 2020·Application pending·0 cites
- 4042US11653484B2Printed circuit board automated layup systemRAYTHEON CO·Filed 2019·Granted May 16, 2023·0 cites·23 claims
- 4141US11432408B2Additive manufactured reactive beamformerRAYTHEON CO·Filed 2019·Granted Aug 30, 2022·0 cites·18 claims
- 4235US2019315500A1Thermally-enhanced and deployable structuresRAYTHEON CO·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →