Inventor · disambiguated record
Jan Willem Bergman
Also filed as: BERGMAN JAN WILLEM
6 granted patents·2 pending applications·7 citations·filing 2014–2023
69Inventor score
Technology areasH10W
Files withNXP BV8
Top patents by PatentIndex Score
8 records- 0182US9379071B2Single inline no-lead semiconductor packageNXP BV·Filed 2014·Granted Jun 28, 2016·7 cites·19 claims
- 0258US12446199B2On-chip shielded deviceNXP BV·Filed 2022·Granted Oct 14, 2025·0 cites·24 claims
- 0358US12315995B2Grounding assembly for a semiconductor deviceNXP BV·Filed 2022·Granted May 27, 2025·0 cites·16 claims
- 0456US12114472B2RF component and methodNXP BV·Filed 2022·Granted Oct 8, 2024·0 cites·20 claims
- 0554US12212074B2Single die design for different polarizationsNXP BV·Filed 2022·Granted Jan 28, 2025·0 cites·17 claims
- 0653US2023402410A1Rf package and method of manufacture of an rf packageNXP BV·Filed 2023·Application pending·0 cites
- 0749US12199333B2Semiconductor device having uniform multi-package antenna array and method of manufactureNXP BV·Filed 2022·Granted Jan 14, 2025·0 cites·14 claims
- 0849US2023290737A1Flip chip device through package via placementNXP BV·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jan Willem Bergman files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →