Inventor · disambiguated record
James M. Blackwell
Also filed as: BLACKWELL JAMES · BLACKWELL JAMES M · BLACKWELL JAMES MUNRO
57 granted patents·17 pending applications·281 citations·filing 2003–2025
98Inventor score
Top patents by PatentIndex Score
74 records- 0198US11444024B2Subtractively patterned interconnect structures for integrated circuitsINTEL CORP·Filed 2020·Granted Sep 13, 2022·10 cites·30 claims
- 0298US7485503B2Dielectric interface for group III-V semiconductor deviceINTEL CORP·Filed 2005·Granted Feb 3, 2009·63 cites·13 claims
- 0397US9041217B1Self-aligned via patterning with multi-colored photobuckets for back end of line (BEOL) interconnectsBRISTOL ROBERT L·Filed 2013·Granted May 26, 2015·53 cites·5 claims
- 0496US10892223B2Advanced lithography and self-assembled devicesINTEL CORP·Filed 2016·Granted Jan 12, 2021·11 cites·25 claims
- 0595US12218052B2Advanced lithography and self-assembled devicesINTEL CORP·Filed 2023·Granted Feb 4, 2025·1 cites·20 claims
- 0695US12027458B2Subtractively patterned interconnect structures for integrated circuitsINTEL CORP·Filed 2022·Granted Jul 2, 2024·2 cites·20 claims
- 0795US9406512B2Self-aligned via patterning with multi-colored photobuckets for back end of line (BEOL) interconnectsBRISTOL ROBERT L·Filed 2015·Granted Aug 2, 2016·16 cites·16 claims
- 0894US8441006B2Cyclic carbosilane dielectric filmsMICHALAK DAVID J·Filed 2010·Granted May 14, 2013·24 cites·17 claims
- 0994US7989280B2Dielectric interface for group III-V semiconductor deviceINTEL CORP·Filed 2008·Granted Aug 2, 2011·20 cites·11 claims
- 1093US10269623B2Image tone-reversal with a dielectric using bottom-up cross-linking for back end of line (BEOL) interconnectsINTEL CORP·Filed 2015·Granted Apr 23, 2019·10 cites·5 claims
- 1191US11854787B2Advanced lithography and self-assembled devicesINTEL CORP·Filed 2022·Granted Dec 26, 2023·1 cites·19 claims
- 1290US9932671B2Precursor and process design for photo-assisted metal atomic layer deposition (ALD) and chemical vapor deposition (CVD)INTEL CORP·Filed 2014·Granted Apr 3, 2018·10 cites·8 claims
- 1388US10366950B2Bottom-up selective dielectric cross-linking to prevent via landing shortsINTEL CORP·Filed 2015·Granted Jul 30, 2019·5 cites·15 claims
- 1488US9530733B2Forming layers of materials over small regions by selective chemical reaction including limiting enchroachment of the layers over adjacent regionsINTEL CORP·Filed 2013·Granted Dec 27, 2016·8 cites·20 claims
- 1588US2025125260A1Advanced lithography and self-assembled devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 1686US7888220B2Self-aligned insulating etchstop layer on a metal contactINTEL CORP·Filed 2008·Granted Feb 15, 2011·11 cites·9 claims
- 1785US11373950B2Advanced lithography and self-assembled devicesINTEL CORP·Filed 2020·Granted Jun 28, 2022·1 cites·19 claims
- 1885US11320734B2Ligand-capped main group nanoparticles as high absorption extreme ultraviolet lithography resistsINTEL CORP·Filed 2016·Granted May 3, 2022·2 cites·16 claims
- 1985US10615117B2Self-aligned viaINTEL CORP·Filed 2016·Granted Apr 7, 2020·4 cites·14 claims
- 2084US9090964B2Additives to improve the performance of a precursor source for cobalt depositionINTEL CORP·Filed 2013·Granted Jul 28, 2015·2 cites·26 claims
- 2183US12482744B2Subtractively patterned interconnect structures for integrated circuitsINTEL CORP·Filed 2024·Granted Nov 25, 2025·0 cites·19 claims
- 2281US7763317B2High K dielectric growth on metal triflate or trifluoroacetate terminated III-V semiconductor surfacesINTEL CORP·Filed 2007·Granted Jul 27, 2010·7 cites·17 claims
- 2380US2025372524A1Integrated circuit structure with filled recessesSK HYNIX NAND PRODUCT SOLUTIONS CORP DBA SOLIDIGM·Filed 2025·Application pending·0 cites
- 2478US11137681B2Lined photobucket structure for back end of line (BEOL) interconnect formationINTEL CORP·Filed 2016·Granted Oct 5, 2021·2 cites·19 claims
- 2577US11874600B2Ligand-capped main group nanoparticles as high absorption extreme ultraviolet lithography resistsINTEL CORP·Filed 2022·Granted Jan 16, 2024·0 cites·14 claims
- 2677US11315798B2Two-stage bake photoresist with releasable quencherINTEL CORP·Filed 2016·Granted Apr 26, 2022·2 cites·11 claims
- 2777US9418888B2Non-lithographically patterned directed self assembly alignment promotion layersINTEL CORP·Filed 2013·Granted Aug 16, 2016·2 cites·25 claims
- 2877US2024360264A1Chemical compositions & methods of patterning microelectronic device structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 2971US12341061B2Bottom-up fill dielectric materials for semiconductor structure fabrication and their methods of fabricationINTEL CORP·Filed 2021·Granted Jun 24, 2025·0 cites·20 claims
- 3071US12037434B2Chemical compositions and methods of patterning microelectronic device structuresINTEL CORP·Filed 2021·Granted Jul 16, 2024·0 cites·6 claims
- 3171US11953826B2Lined photobucket structure for back end of line (BEOL) interconnect formationINTEL CORP·Filed 2021·Granted Apr 9, 2024·0 cites·20 claims
- 3270US11955343B2Two-stage bake photoresist with releasable quencherINTEL CORP·Filed 2022·Granted Apr 9, 2024·0 cites·9 claims
- 3370US11232980B2Bottom-up fill dielectric materials for semiconductor structure fabrication and their methods of fabricationINTEL CORP·Filed 2016·Granted Jan 25, 2022·1 cites·6 claims
- 3470US9385033B2Method of forming a metal from a cobalt metal precursorBLACKWELL JAMES M·Filed 2013·Granted Jul 5, 2016·3 cites·10 claims
- 3569US9269652B2Chemically altered carbosilanes for pore sealing applicationsMICHALAK DAVID J·Filed 2011·Granted Feb 23, 2016·2 cites·18 claims
- 3667US12012473B2Directed self-assembly structures and techniquesINTEL CORP·Filed 2020·Granted Jun 18, 2024·0 cites·20 claims
- 3767US11955377B2Differential hardmasks for modulation of electrobucket sensitivityINTEL CORP·Filed 2022·Granted Apr 9, 2024·0 cites·21 claims
- 3863US8686517B2Self-aligned insulating etchstop layer on a metal contactRACHMADY WILLY·Filed 2010·Granted Apr 1, 2014·1 cites·6 claims
- 3962US7879739B2Thin transition layer between a group III-V substrate and a high-k gate dielectric layerINTEL CORP·Filed 2006·Granted Feb 1, 2011·1 cites·7 claims
- 4061US12260296B1Diamondoid materials in quantum computing devicesINTEL CORP·Filed 2020·Granted Mar 25, 2025·0 cites·20 claims
- 4161US2025110408A1Switchable underlayers for euv lithographyINTEL CORP·Filed 2023·Application pending·0 cites
- 4259US6967256B2Formation of enediynes by reductive coupling followed by alkyne metathesisMASSACHUSETTS INST TECHNOLOGY·Filed 2003·Granted Nov 22, 2005·3 cites·55 claims
- 4358US11846883B2Chain scission photoresists and methods for forming chain scission photoresistsINTEL CORP·Filed 2018·Granted Dec 19, 2023·0 cites·10 claims
- 4458US9570349B2Non-lithographically patterned directed self assembly alignment promotion layersINTEL CORP·Filed 2016·Granted Feb 14, 2017·0 cites·13 claims
- 4556US11262654B2Chain scission resist compositions for EUV lithography applicationsINTEL CORP·Filed 2019·Granted Mar 1, 2022·0 cites·17 claims
- 4656US9070553B2Cyclic carbosilane dielectric filmsINTEL CORP·Filed 2013·Granted Jun 30, 2015·0 cites·7 claims
- 4756US8969165B2Self-aligned insulating etchstop layer on a metal contactINTEL CORP·Filed 2014·Granted Mar 3, 2015·0 cites·20 claims
- 4856US2024222119A1Patterning based on in-situ formation of block copoylmer through deprotectionINTEL CORP·Filed 2022·Application pending·0 cites
- 4955US2024201586A1Precursors and methods for producing tin-based photoresistINTEL CORP·Filed 2022·Application pending·0 cites
- 5054US12412838B2Integrated circuit structure with filled recessesINTEL CORP·Filed 2019·Granted Sep 9, 2025·0 cites·20 claims
Showing the top 50 of 74 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →