Inventor · disambiguated record
Jason Boyd
Also filed as: BOYD JASON · BOYD JASON GRAEME
6 granted patents·4 pending applications·20 citations·filing 2002–2021
79Inventor score
Top patents by PatentIndex Score
10 records- 0190US10239278B2Wrapping material and method of manufacture for baling materialsTAMA PLASTIC IND·Filed 2016·Granted Mar 26, 2019·5 cites·17 claims
- 0286US10960639B2Wrapping material and method of manufacturing for baling materialsTama group·Filed 2019·Granted Mar 30, 2021·4 cites·18 claims
- 0384US9352479B2Lattice cutting machine systemJ R SIMPLOT·Filed 2013·Granted May 31, 2016·6 cites·13 claims
- 0483US12011906B2Methods of wrapping an item with a wrapping materialTama group·Filed 2021·Granted Jun 18, 2024·1 cites·19 claims
- 0583US10286625B2Wrapping material and method of manufacture for baling materialsTAMA PLASTIC IND·Filed 2014·Granted May 14, 2019·4 cites·21 claims
- 0656US2016055437A1Resource capacity management frameworkBANK OF AMERICA·Filed 2014·Application pending·0 cites
- 0755US2016243716A1Lattice cutting machine systemSIMPLOT CO J R·Filed 2016·Application pending·0 cites
- 0853US2003127512A1Secure identification systemFiled 2002·Application pending·0 cites
- 0938US2012056433A1Techniques for the efficient generation of electric current by translation of force through hydraulic couplingBOYD JASON·Filed 2010·Application pending·0 cites
- 1033US9349602B2Semiconductor wafer chuck and methodJST MFG INC·Filed 2014·Granted May 24, 2016·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →