Inventor · disambiguated record
Jay A. Bunt
Also filed as: BUNT JAY A
13 granted patents·1 pending application·48 citations·filing 2005–2022
87Inventor score
Top patents by PatentIndex Score
14 records- 0197US11191155B1Tamper-respondent assembly with structural material within sealed inner compartmentIBM·Filed 2020·Granted Nov 30, 2021·16 cites·20 claims
- 0295US10842043B1Fabricating coolant-cooled heat sinks with internal thermally-conductive finsIBM·Filed 2019·Granted Nov 17, 2020·22 cites·20 claims
- 0394US11156409B2Coolant-cooled heat sinks with internal thermally-conductive fins joined to the coverIBM·Filed 2020·Granted Oct 26, 2021·6 cites·20 claims
- 0477US11158562B2Conformal integrated circuit (IC) device package lidIBM·Filed 2020·Granted Oct 26, 2021·1 cites·19 claims
- 0577US7836935B2Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriersIBM·Filed 2008·Granted Nov 23, 2010·3 cites·4 claims
- 0662US12274966B2Filter device having multiple changeable filter surfacesIBM·Filed 2022·Granted Apr 15, 2025·0 cites·16 claims
- 0760US12005148B2Coolant-cooled heat sink(s) with associated ultra-violet light assemblyIBM·Filed 2021·Granted Jun 11, 2024·0 cites·17 claims
- 0859US11940271B2High power device fault localization via die surface contouringIBM·Filed 2020·Granted Mar 26, 2024·0 cites·20 claims
- 0954US11430710B2Lid/heat spreader having targeted flexibilityIBM·Filed 2020·Granted Aug 30, 2022·0 cites·20 claims
- 1052US7947143B2Method for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriersIBM·Filed 2008·Granted May 24, 2011·0 cites·4 claims
- 1149US11614324B2Non-destructive bond line thickness measurement of thermal interface material on silicon packagesIBM·Filed 2019·Granted Mar 28, 2023·0 cites·12 claims
- 1248US11716808B2Tamper-respondent assemblies with porous heat transfer element(s)IBM·Filed 2020·Granted Aug 1, 2023·0 cites·18 claims
- 1347US2007113950A1Method and apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriersIBM·Filed 2005·Application pending·0 cites
- 1446US8156990B2Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriersBUNT JAY A·Filed 2008·Granted Apr 17, 2012·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →