Inventor · disambiguated record
James A. Busby
Also filed as: BUSBY JAMES · BUSBY JAMES A
62 granted patents·399 citations·filing 1999–2022
98Inventor score
Top patents by PatentIndex Score
62 records- 0198US9858776B1Tamper-respondent assembly with nonlinearity monitoringIBM·Filed 2016·Granted Jan 2, 2018·14 cites·17 claims
- 0298US9661747B1Tamper-respondent assemblies with enclosure-to-board protectionIBM·Filed 2016·Granted May 23, 2017·43 cites·15 claims
- 0398US9554477B1Tamper-respondent assemblies with enclosure-to-board protectionIBM·Filed 2015·Granted Jan 24, 2017·48 cites·16 claims
- 0497US9881880B2Tamper-proof electronic packages with stressed glass component substrate(s)IBM·Filed 2016·Granted Jan 30, 2018·15 cites·13 claims
- 0597US9877383B2Tamper-respondent assemblies with enclosure-to-board protectionIBM·Filed 2017·Granted Jan 23, 2018·17 cites·12 claims
- 0696US9936573B2Tamper-respondent assembliesIBM·Filed 2015·Granted Apr 3, 2018·13 cites·13 claims
- 0796US9924591B2Tamper-respondent assembliesIBM·Filed 2015·Granted Mar 20, 2018·13 cites·20 claims
- 0896US9916744B2Multi-layer stack with embedded tamper-detect protectionIBM·Filed 2016·Granted Mar 13, 2018·13 cites·11 claims
- 0996US9913370B2Tamper-proof electronic packages formed with stressed glassIBM·Filed 2016·Granted Mar 6, 2018·14 cites·18 claims
- 1096US9913362B2Tamper-respondent assemblies with bond protectionIBM·Filed 2015·Granted Mar 6, 2018·13 cites·10 claims
- 1196US9894749B2Tamper-respondent assemblies with bond protectionIBM·Filed 2015·Granted Feb 13, 2018·15 cites·18 claims
- 1295US10306753B1Enclosure-to-board interface with tamper-detect circuit(s)IBM·Filed 2018·Granted May 28, 2019·16 cites·13 claims
- 1395US9999124B2Tamper-respondent assemblies with trace regions of increased susceptibility to breakingIBM·Filed 2016·Granted Jun 12, 2018·15 cites·20 claims
- 1493US7709951B2Thermal pillowIBM·Filed 2007·Granted May 4, 2010·27 cites·20 claims
- 1592US10217336B2Multi-layer stack with embedded tamper-detect protectionIBM·Filed 2018·Granted Feb 26, 2019·5 cites·10 claims
- 1691US10136519B2Circuit layouts of tamper-respondent sensorsIBM·Filed 2016·Granted Nov 20, 2018·6 cites·12 claims
- 1790US10169968B1Multi-layer stack with embedded tamper-detect protectionIBM·Filed 2018·Granted Jan 1, 2019·4 cites·11 claims
- 1890US10169967B1Multi-layer stack with embedded tamper-detect protectionIBM·Filed 2018·Granted Jan 1, 2019·4 cites·13 claims
- 1990US10143090B2Circuit layouts of tamper-respondent sensorsIBM·Filed 2015·Granted Nov 27, 2018·6 cites·19 claims
- 2089US10177102B2Tamper-proof electronic packages with stressed glass component substrate(s)IBM·Filed 2017·Granted Jan 8, 2019·4 cites·7 claims
- 2189US10172232B2Tamper-respondent assemblies with enclosure-to-board protectionIBM·Filed 2017·Granted Jan 1, 2019·4 cites·13 claims
- 2289US10115275B2Multi-layer stack with embedded tamper-detect protectionIBM·Filed 2017·Granted Oct 30, 2018·4 cites·9 claims
- 2388US7795724B2Sandwiched organic LGA structureIBM·Filed 2007·Granted Sep 14, 2010·16 cites·12 claims
- 2487US10595401B1Tamper detection at enclosure-to-board interfaceIBM·Filed 2019·Granted Mar 17, 2020·5 cites·20 claims
- 2585US10242543B2Tamper-respondent assembly with nonlinearity monitoringIBM·Filed 2017·Granted Mar 26, 2019·3 cites·20 claims
- 2684US10531561B2Enclosure-to-board interface with tamper-detect circuit(s)IBM·Filed 2019·Granted Jan 7, 2020·3 cites·11 claims
- 2784US10327329B2Tamper-respondent assembly with flexible tamper-detect sensor(s) overlying in-situ-formed tamper-detect sensorIBM·Filed 2017·Granted Jun 18, 2019·4 cites·20 claims
- 2884US10257924B2Tamper-proof electronic packages formed with stressed glassIBM·Filed 2017·Granted Apr 9, 2019·3 cites·19 claims
- 2982US10595419B13-D flex circuit formingIBM·Filed 2018·Granted Mar 17, 2020·3 cites·8 claims
- 3081US11244079B2Data detection mitigation in printed circuit boardsIBM·Filed 2019·Granted Feb 8, 2022·2 cites·20 claims
- 3181US7137826B2Temperature dependent semiconductor module connectorsIBM·Filed 2005·Granted Nov 21, 2006·8 cites·14 claims
- 3280US10334722B2Tamper-respondent assembliesIBM·Filed 2017·Granted Jun 25, 2019·2 cites·5 claims
- 3378US11493565B2Leakage characterization and management for electronic circuit enhancementIBM·Filed 2019·Granted Nov 8, 2022·2 cites·18 claims
- 3477US10264665B2Tamper-respondent assemblies with bond protectionIBM·Filed 2017·Granted Apr 16, 2019·1 cites·18 claims
- 3572US11083082B2Enclosure-to-board interface with tamper-detect circuit(s)IBM·Filed 2019·Granted Aug 3, 2021·1 cites·20 claims
- 3671US10956623B2Enclosure with tamper respondent sensorIBM·Filed 2018·Granted Mar 23, 2021·1 cites·25 claims
- 3769US12207392B2Electronic component comprising first and second conductive traces and a void formed in an insulative layer between the first and second traces providing crosstalk reductionIBM·Filed 2022·Granted Jan 21, 2025·0 cites·20 claims
- 3867US11122682B2Tamper-respondent sensors with liquid crystal polymer layersIBM·Filed 2018·Granted Sep 14, 2021·1 cites·14 claims
- 3967US10575398B2Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layoutIBM·Filed 2017·Granted Feb 25, 2020·0 cites·5 claims
- 4064US11614497B2Leakage characterization for electronic circuit temperature monitoringIBM·Filed 2019·Granted Mar 28, 2023·0 cites·12 claims
- 4164US8197612B2Optimization of metallurgical properties of a solder jointBUSBY JAMES A·Filed 2008·Granted Jun 12, 2012·2 cites·15 claims
- 4264US6848914B2Electrical coupling of substrates by conductive buttonsIBM·Filed 2001·Granted Feb 1, 2005·13 cites·67 claims
- 4363US7128579B1Hook interconnectIBM·Filed 2005·Granted Oct 31, 2006·7 cites·20 claims
- 4462US11147158B2Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layoutIBM·Filed 2019·Granted Oct 12, 2021·0 cites·15 claims
- 4562US10798816B1Tamper detection at enclosure-to-board interfaceIBM·Filed 2020·Granted Oct 6, 2020·0 cites·20 claims
- 4661US10624202B2Tamper-respondent assemblies with bond protectionIBM·Filed 2017·Granted Apr 14, 2020·0 cites·9 claims
- 4761US7255571B2Temperature dependent semiconductor module connectorsIBM·Filed 2006·Granted Aug 14, 2007·1 cites·19 claims
- 4860US12414229B2Tearing security feature of printed circuit substratesIBM·Filed 2022·Granted Sep 9, 2025·0 cites·11 claims
- 4960US12005148B2Coolant-cooled heat sink(s) with associated ultra-violet light assemblyIBM·Filed 2021·Granted Jun 11, 2024·0 cites·17 claims
- 5060US10932374B23-D flex circuit formingIBM·Filed 2020·Granted Feb 23, 2021·0 cites·16 claims
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →