Inventor · disambiguated record
Jay Chao
Also filed as: CHAO JAY
1 granted patent·1 pending application·0 citations·filing 2021–2024
10Inventor score
Technology areasH10W
Files withHENKEL AG & CO KGAA2
Top patents by PatentIndex Score
2 records- 0153US2024301129A1Liquid mold compounds, reaction products of which become platable upon exposure to laser energyHENKEL AG & CO KGAA·Filed 2024·Application pending·0 cites
- 0250US12187843B2Liquid compression molding or encapsulant compositionsHENKEL AG & CO KGAA·Filed 2021·Granted Jan 7, 2025·0 cites·9 claims
Join the waitlist — get patent alerts
Get an alert when Jay Chao files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →