Inventor · disambiguated record
Jae Choon Cho
Also filed as: CHO JAE C · CHO JAE CHOON
10 granted patents·23 pending applications·5 citations·filing 2006–2014
79Inventor score
Top patents by PatentIndex Score
33 records- 0164US7644496B2Manufacturing method for imprinting stamperSAMSUNG ELECTRO MECH·Filed 2007·Granted Jan 12, 2010·2 cites·6 claims
- 0259US9318234B2Insulating film and producing method for insulating filmSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 19, 2016·1 cites·3 claims
- 0359US7562447B2Method of manufacturing printed circuit board for fine circuit formationSAMSUNG ELECTRO MECH·Filed 2007·Granted Jul 21, 2009·2 cites·7 claims
- 0456US9202624B2Conductive paste composition for external electrode and multilayer ceramic electronic component fabricated using the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 1, 2015·0 cites·12 claims
- 0552US8431656B2Curable cyclic phosphazene compound and method of preparing the sameCHO JAE CHOON·Filed 2009·Granted Apr 30, 2013·0 cites·3 claims
- 0652US2010270064A1Resin composition for printed circuit board and printed circuit board using the sameCHO JAE CHOON·Filed 2009·Application pending·0 cites
- 0750US2008090084A1Flame retardant resin composition for printed circuit board and printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 0850US2015056472A1Laminate for Printed Circuit Board and Printed Circuit Board Using The SameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0949US8829155B2Poly(p-xylylene)-based polymer having low dielectric constant and low-loss property and insulating material, printed circuit board and functional element using the sameCHO JAE-CHOON·Filed 2009·Granted Sep 9, 2014·0 cites·6 claims
- 1049US2010063226A1Norbornene-based polymer having low dielectric constant and low-loss properties, and insulating material, printed circuit board and function element using the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1149US2015053458A1Insulating film for printed circuit board and products having the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1248US2010270065A1Resin Composition For Printed Circuit Board and Printed Circuit Board Using The SameCHO JAE CHOON·Filed 2009·Application pending·0 cites
- 1348US2010210803A1Norbornene-based polymer having low dielectric constant and low-loss properties and insulating material using the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1448US2008012168A1Method for manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1547US2014037889A1Insulator for build-up pcb and method of manufacturing pcb using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1646US8309636B2Flame retardant resin composition for multilayer wiring board and multilayer wiring board including the sameJUNG HYUNG MI·Filed 2011·Granted Nov 13, 2012·0 cites·17 claims
- 1745US2009072207A1Flame retardant resin composition for printed circuit board, printed circuit board using the same and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1845US2008034581A1Method for manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1945US2014041445A1Apparatus for measuring drying rate and method for measuring drying rate using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2044US8216503B2Method for manufacturing printed circuit board using imprintingCHO JAE-CHOON·Filed 2007·Granted Jul 10, 2012·0 cites·10 claims
- 2144US2008057444A1Method of manufacturing a broad stamperSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 2243US8840967B2Method for manufacturing printed circuit board including flame retardant insulation layerCHO JAE-CHOON·Filed 2011·Granted Sep 23, 2014·0 cites·13 claims
- 2343US7666292B2Method of manufacturing printed circuit board using imprinting processSAMSUNG ELECTRO MECH·Filed 2006·Granted Feb 23, 2010·0 cites·2 claims
- 2442US2007020397A1Method of fabricating printed circuit board using imprinting processSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 2541US2014014402A1Epoxy resin composition for build-up insulating film, insulating film formed therefrom, and multilayer printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2641US2006222833A1Imprinting mold for printed circuit board having excellent durability and method of manufacturing printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 2741US2014017487A1Insulation film having metal layerSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2840US2012103507A1Photosensitive composite and build-up insulation film with the photosensitive composite, and method for manufacturing circuit board using the build-up insulation filmCHO JAE CHOON·Filed 2011·Application pending·0 cites
- 2939US2012077039A1Polymer resin composition, insulating film manufactured using the polymer resin composition, and method of manufacturing the insulating filmLEE KYU SANG·Filed 2011·Application pending·0 cites
- 3038US2011298786A1Color electronic paper display device and method for manufacturing the sameCHO JAE CHOON·Filed 2010·Application pending·0 cites
- 3134US2012125667A1Printed circuit board and method of manufacturing the sameJUNG HYUNG MI·Filed 2011·Application pending·0 cites
- 3233US2012074430A1Radiating substrate and method for manufacturing the radiating substrate, and luminous element package with the radiating substrateLEE KYU SANG·Filed 2011·Application pending·0 cites
- 3332US2011317382A1Insulating resin composition and printed circuit substrate using the sameCHO JAE CHOON·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →