Inventor · disambiguated record
Jaemyung Choi
Also filed as: CHOI JAEMYUNG
6 granted patents·14 pending applications·0 citations·filing 2019–2024
63Inventor score
Files withSAMSUNG ELECTRONICS CO LTD20
Top patents by PatentIndex Score
20 records- 0171US12278168B1Semiconductor device including interconnect structure with planarization stop layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Apr 15, 2025·0 cites·20 claims
- 0268US12394704B1Semiconductor device including interconnect structure with metal bridge pattern connecting adjacent metal linesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 0359US2025372451A1Planarization method for back-end-of-line region of integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0458US2025157916A1Integrated circuit having upper lines with different metals and widths, and related fabrication methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0558US2025349721A1Semiconductor device including interconnect structure with metal jump structure connecting adjacent metal linesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0658US2025167106A1Interconnect structure including metal lines having different metal heightsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0758US2025174494A1Beol fabrication method including removing dummy linesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0857US2025308989A1Semiconductor device including interconnect structure with capping structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0956US12347774B2Integrated circuit devices including metal lines spaced apart from metal vias, and related fabrication methodsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·18 claims
- 1056US2025125253A1Bridge-free and cmp-friendly interconnect structure in semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1156US2024355727A1Integrated circuit devices including a conductive via and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1255US12200920B2Integrated circuit devices including a power distribution network and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·23 claims
- 1353US11837475B2Semiconductor device including conductive line and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
- 1453US2025022797A1Interconnect structure including metal line and top via formed through different processesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1548US2023343698A1Interconnect structure of semiconductor device including metal pattern or via structure with sidewall spacer structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1648US2023369111A1Integrated circuit devices including metal structures having a curved interface and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1747US2023361032A1Wet recess for ru subtractive processSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1847US2023352399A1Integrated circuit devices including a via and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1946US2023343697A1Semiconductor device including spacer via structure and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2044US10892185B2Semiconductor device including a blocking pattern in an interconnection lineSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 12, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →