Inventor · disambiguated record
James H. Covell
Also filed as: COVELL II JAMES H · COVELL II JAMES HOWARD · COVELL JAMES H · COVELL JAMES H II
16 granted patents·3 pending applications·677 citations·filing 1995–2007
95Inventor score
Files withIBM19
Top patents by PatentIndex Score
19 records- 0194US5718361AApparatus and method for forming mold for metallic materialIBM·Filed 1995·Granted Feb 17, 1998·123 cites·44 claims
- 0289US6276596B1Low temperature solder column attach by injection molded solder and structure formedIBM·Filed 2000·Granted Aug 21, 2001·54 cites·20 claims
- 0388US6278193B1Optical sensing method to place flip chipsIBM·Filed 1998·Granted Aug 21, 2001·95 cites·16 claims
- 0485US5718367AMold transfer apparatus and methodIBM·Filed 1995·Granted Feb 17, 1998·88 cites·67 claims
- 0584US5821161ACast metal seal for semiconductor substrates and process thereofIBM·Filed 1997·Granted Oct 13, 1998·79 cites·21 claims
- 0683US5982038ACast metal seal for semiconductor substratesIBM·Filed 1997·Granted Nov 9, 1999·71 cites·17 claims
- 0781US5968670AEnhanced ceramic ball grid array using in-situ solder stretch with springIBM·Filed 1997·Granted Oct 19, 1999·63 cites·17 claims
- 0872US5971058AApparatus and method for continuous casting solder onto discrete partsIBM·Filed 1997·Granted Oct 26, 1999·37 cites·8 claims
- 0962US6964885B2Stress resistant land grid array (LGA) module and method of forming the sameIBM·Filed 2004·Granted Nov 15, 2005·9 cites·33 claims
- 1062US6333209B1One step method for curing and joining BGA solder ballsIBM·Filed 1999·Granted Dec 25, 2001·27 cites·14 claims
- 1158US6703560B2Stress resistant land grid array (LGA) module and method of forming the sameIBM·Filed 2001·Granted Mar 9, 2004·7 cites·7 claims
- 1253US7806312B2Method and apparatus for removing known good dieIBM·Filed 2006·Granted Oct 5, 2010·0 cites·20 claims
- 1349US7989229B2Tactile surface inspection during device fabrication or assemblyIBM·Filed 2007·Granted Aug 2, 2011·0 cites·22 claims
- 1448US2008076690A1Non-hermetic encapsulant removal for module reworkIBM·Filed 2007·Application pending·0 cites
- 1544US5961032AMethod of fabrication of a multi-component solder column by blocking a portion of a through hole in a moldIBM·Filed 1997·Granted Oct 5, 1999·12 cites·6 claims
- 1644US5504612ASynchronized XY laser scannerIBM·Filed 1995·Granted Apr 2, 1996·12 cites·11 claims
- 1742US7168609B2Method and apparatus for removing known good dieIBM·Filed 2002·Granted Jan 30, 2007·0 cites·18 claims
- 1839US2005066995A1Non-hermetic encapsulant removal for module reworkIBM·Filed 2003·Application pending·0 cites
- 1938US2002023945A1Low temperature solder column attach by injection molded solder and structure formedIBM·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →