Inventor · disambiguated record
James E. Davis
Also filed as: DAVIS JAMES · DAVIS JAMES E · DAVIS JAMES ERIC
26 granted patents·8 pending applications·49 citations·filing 2011–2025
94Inventor score
Top patents by PatentIndex Score
34 records- 0195US10128229B1Semiconductor devices with package-level configurabilityMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 13, 2018·12 cites·8 claims
- 0294US10483241B1Semiconductor devices with through silicon vias and package-level configurabilityMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 19, 2019·13 cites·21 claims
- 0392US10312232B1Semiconductor devices with package-level configurabilityMICRON TECHNOLOGY INC·Filed 2018·Granted Jun 4, 2019·6 cites·8 claims
- 0487US10283462B1Semiconductor devices with post-probe configurabilityMICRON TECHNOLOGY INC·Filed 2017·Granted May 7, 2019·4 cites·10 claims
- 0584US10193334B2Apparatuses and method for over-voltage event protectionMICRON TECHNOLOGY INC·Filed 2016·Granted Jan 29, 2019·2 cites·19 claims
- 0683US10580767B2Semiconductor devices with package-level configurabilityMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 3, 2020·2 cites·14 claims
- 0782US2025343083A1Memory device including circuitry under bond padsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0879US11424169B2Memory device including circuitry under bond padsMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 23, 2022·2 cites·17 claims
- 0979US2025308600A1Discharge circuitsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1077US12513998B2Apparatus with voltage protection mechanismMICRON TECHNOLOGY INC·Filed 2023·Granted Dec 30, 2025·0 cites·9 claims
- 1174US11848323B2Semiconductor devices with package-level configurabilityMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 19, 2023·0 cites·20 claims
- 1273US12362244B2Memory device including circuitry under bond padsMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 1373US11901727B2Apparatuses and method for over-voltage event protectionMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 13, 2024·0 cites·12 claims
- 1472US9281682B2Apparatuses and method for over-voltage event protectionMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 8, 2016·2 cites·25 claims
- 1571US11798935B2Apparatus with voltage protection mechanismMICRON TECHNOLOGY INC·Filed 2022·Granted Oct 24, 2023·0 cites·5 claims
- 1671US10930645B2Semiconductor devices with package-level configurabilityMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 23, 2021·0 cites·20 claims
- 1771US10784192B2Semiconductor devices having 3-dimensional inductive structuresMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 22, 2020·1 cites·20 claims
- 1871US10403585B2Semiconductor devices with post-probe configurabilityMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 3, 2019·1 cites·11 claims
- 1970US12354669B2Discharge circuitsMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 8, 2025·0 cites·23 claims
- 2069US10867991B2Semiconductor devices with package-level configurabilityMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 15, 2020·1 cites·19 claims
- 2167US11508657B2Semiconductor devices having 3-dimensional inductive structuresMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 2266US9391062B2Apparatuses, circuits, and methods for protection circuits for dual-direction nodesDAVIS JAMES E·Filed 2011·Granted Jul 12, 2016·2 cites·31 claims
- 2364US11398468B2Apparatus with voltage protection mechanismMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 26, 2022·1 cites·14 claims
- 2462US11183837B2Apparatuses and method for over-voltage event protectionMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 23, 2021·0 cites·6 claims
- 2562US2024395325A1Method and apparatus of memory array device with low arcing riskMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2661US2025180640A1Plasma induced damage detection of a memory dieMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2760US10811372B2Semiconductor devices with post-probe configurabilityMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 20, 2020·0 cites·10 claims
- 2856US11056467B2Semiconductor devices with through silicon vias and package-level configurabilityMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 6, 2021·0 cites·17 claims
- 2956US2024290385A1Microelectronic devices including through-silicon vias, and related memory devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3051US2024372360A1Drain-ballasted electrostatic discharge protection circuitsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3150US2025014665A1Triple via chain for advanced interconnect in a memory deviceMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3244US11908812B2Multi-die memory device with peak current reductionMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 3344US10453829B2Method and apparatus for reducing capacitance of input/output pins of memory deviceINTEL CORP·Filed 2017·Granted Oct 22, 2019·0 cites·22 claims
- 3442US2023017305A1Well ring for resistive ground power domain segregationMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →