Inventor · disambiguated record
James Dean Eoff
Also filed as: EOFF JAMES · EOFF JAMES DEAN · EOFF SR JAMES DEAN
10 granted patents·1 pending application·23 citations·filing 1998–2024
83Inventor score
Top patents by PatentIndex Score
11 records- 0194US11795569B2Systems for producing a single crystal silicon ingot using a vaporized dopantGLOBALWAFERS CO LTD·Filed 2020·Granted Oct 24, 2023·6 cites·12 claims
- 0288US10679908B2Cleave systems, mountable cleave monitoring systems, and methods for separating bonded wafer structuresGLOBALWAFERS CO LTD·Filed 2018·Granted Jun 9, 2020·7 cites·18 claims
- 0382US11499245B2Additive feed systems, ingot puller apparatus and methods for forming a single crystal silicon ingot with use of such additive feed systemsGLOBALWAFERS CO LTD·Filed 2020·Granted Nov 15, 2022·1 cites·19 claims
- 0476US12503790B2Systems and methods for producing a single crystal silicon ingot using a vaporized dopantGLOBALWAFERS CO LTD·Filed 2024·Granted Dec 23, 2025·0 cites·16 claims
- 0571US12270768B2Method of processing a cleaved semiconductor waferGLOBALWAFERS CO LTD·Filed 2021·Granted Apr 8, 2025·0 cites·17 claims
- 0671US11921054B2Cleaved semiconductor wafer camera systemGLOBALWAFERS CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·19 claims
- 0769US12019031B2Cleaved semiconductor wafer imaging systemGLOBALWAFERS CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 0856US11866844B2Methods for producing a single crystal silicon ingot using a vaporized dopantGLOBALWAFERS CO LTD·Filed 2020·Granted Jan 9, 2024·0 cites·19 claims
- 0955US2025157847A1Systems and methods for bond treating and cleaving of silicon wafersGLOBALWAFERS CO LTD·Filed 2023·Application pending·0 cites
- 1053US10910280B2Methods for separating bonded wafer structuresGLOBALWAFERS CO LTD·Filed 2019·Granted Feb 2, 2021·0 cites·19 claims
- 1133US6089285AMethod and system for supplying semiconductor source materialMEMC ELECTRONICS MATERIALS INC·Filed 1998·Granted Jul 18, 2000·9 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →