Inventor · disambiguated record
Javier A. Falcon
Also filed as: FALCON JAVIER A
16 granted patents·5 pending applications·146 citations·filing 2015–2022
93Inventor score
Top patents by PatentIndex Score
21 records- 0198US10380496B2Quantum computing assembliesINTEL CORP·Filed 2018·Granted Aug 13, 2019·50 cites·25 claims
- 0297US11387200B2Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabricINTEL CORP·Filed 2020·Granted Jul 12, 2022·4 cites·20 claims
- 0396US11955434B2Ultra small molded module integrated with die by module-on-wafer assemblyINTEL CORP·Filed 2022·Granted Apr 9, 2024·2 cites·22 claims
- 0496US10756004B1Quantum computing assemblies with through-hole diesINTEL CORP·Filed 2019·Granted Aug 25, 2020·19 cites·20 claims
- 0596US10319896B2Shielded interconnectsINTEL CORP·Filed 2017·Granted Jun 11, 2019·19 cites·25 claims
- 0694US10468578B2Package substrates with top superconductor layers for qubit devicesINTEL CORP·Filed 2018·Granted Nov 5, 2019·11 cites·25 claims
- 0792US10573608B2Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on packageINTEL CORP·Filed 2015·Granted Feb 25, 2020·9 cites·22 claims
- 0888US11177912B2Quantum circuit assemblies with on-chip demultiplexersINTEL CORP·Filed 2018·Granted Nov 16, 2021·8 cites·23 claims
- 0988US10629551B2Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabricINTEL CORP·Filed 2015·Granted Apr 21, 2020·5 cites·19 claims
- 1088US10256206B2Qubit die attachment using preformsINTEL CORP·Filed 2018·Granted Apr 9, 2019·6 cites·20 claims
- 1187US9728425B1Space-efficient underfilling techniques for electronic assembliesINTEL CORP·Filed 2016·Granted Aug 8, 2017·3 cites·17 claims
- 1286US10707171B2Ultra small molded module integrated with die by module-on-wafer assemblyINTEL CORP·Filed 2015·Granted Jul 7, 2020·5 cites·8 claims
- 1376US11335651B2Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabricINTEL CORP·Filed 2015·Granted May 17, 2022·2 cites·14 claims
- 1468US11296052B2TSV-less die stacking using plated pillars/through mold interconnectINTEL CORP·Filed 2017·Granted Apr 5, 2022·2 cites·14 claims
- 1568US10971453B2Semiconductor packaging with high density interconnectsINTEL CORP·Filed 2016·Granted Apr 6, 2021·1 cites·20 claims
- 1665US11881457B2Semiconductor packaging with high density interconnectsTAHOE RES LTD·Filed 2021·Granted Jan 23, 2024·0 cites·19 claims
- 1765US2022246554A1Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabricINTEL CORP·Filed 2022·Application pending·0 cites
- 1863US2020286834A1Ultra small molded module integrated with die by module-on-wafer assemblyINTEL CORP·Filed 2020·Application pending·0 cites
- 1961US2018061673A1Space-efficient underfilling techniques for electronic assembliesINTEL CORP·Filed 2017·Application pending·0 cites
- 2048US2022199449A1Carrier for microelectronic assemblies having direct bondingINTEL CORP·Filed 2020·Application pending·0 cites
- 2131US2017179080A1Semiconductor package interposer having encapsulated interconnectsINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →