Inventor · disambiguated record
James Fiore
Also filed as: FIORE JAMES
2 granted patents·1 pending application·256 citations·filing 1996–2007
71Inventor score
Top patents by PatentIndex Score
3 records- 0191US6204074B1Chip design process for wire bond and flip-chip packageIBM·Filed 1997·Granted Mar 20, 2001·150 cites·20 claims
- 0283US5844317AConsolidated chip design for wire bond and flip-chip package technologiesIBM·Filed 1996·Granted Dec 1, 1998·106 cites·17 claims
- 0340US2009280503A1Method for detecting and treating skin disordersFIORE JAMES·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →