Inventor · disambiguated record
James E. Fluegel
Also filed as: FLUEGEL JAMES E · FLUEGEL JAMES EDWARD
11 granted patents·2 pending applications·240 citations·filing 1998–2008
90Inventor score
Files withIBM13
Top patents by PatentIndex Score
13 records- 0190US6270646B1Electroplating apparatus and method using a compressible contactIBM·Filed 1999·Granted Aug 7, 2001·82 cites·22 claims
- 0289US6471845B1Method of controlling chemical bath composition in a manufacturing environmentIBM·Filed 1999·Granted Oct 29, 2002·63 cites·11 claims
- 0386US6627052B2Electroplating apparatus with vertical electrical contactIBM·Filed 2000·Granted Sep 30, 2003·37 cites·15 claims
- 0481US7407605B2Manufacturable CoWP metal cap process for copper interconnectsIBM·Filed 2007·Granted Aug 5, 2008·8 cites·3 claims
- 0570US6395164B1Copper seed layer repair technique using electroless touch-upIBM·Filed 1999·Granted May 28, 2002·36 cites·3 claims
- 0657US7678258B2Void-free damascene copper deposition process and means of monitoring thereofIBM·Filed 2003·Granted Mar 16, 2010·1 cites·11 claims
- 0757US6077405AMethod and apparatus for making electrical contact to a substrate during electroplatingIBM·Filed 1998·Granted Jun 20, 2000·11 cites·17 claims
- 0845US7253106B2Manufacturable CoWP metal cap process for copper interconnectsIBM·Filed 2004·Granted Aug 7, 2007·1 cites·41 claims
- 0945US6241868B1Method for electroplating a film onto a substrateIBM·Filed 2000·Granted Jun 5, 2001·0 cites·14 claims
- 1044US7227265B2Electroplated copper interconnection structure, process for making and electroplating bathIBM·Filed 2004·Granted Jun 5, 2007·1 cites·21 claims
- 1142US7901490B2Reducing introduction of foreign material to wafersIBM·Filed 2008·Granted Mar 8, 2011·0 cites·20 claims
- 1239US2010051501A1Ic waper carrier sealed from ambient atmosphere during transportation from one process to the nextIBM·Filed 2008·Application pending·0 cites
- 1338US2004094511A1Method of forming planar Cu interconnects without chemical mechanical polishingIBM·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →