Inventor · disambiguated record
Jackie Fu
Also filed as: FU JACKIE
2 granted patents·1 pending application·84 citations·filing 2002–2002
67Inventor score
Files withVIA TECH INC2
Top patents by PatentIndex Score
3 records- 0183US6569712B2Structure of a ball-grid array package substrate and processes for producing thereofVIA TECH INC·Filed 2002·Granted May 27, 2003·45 cites·12 claims
- 0281US6779783B2Method and structure for tape ball grid array packageVIA TECH INC·Filed 2002·Granted Aug 24, 2004·39 cites·38 claims
- 0333US2003143884A1Pin-typed electric connection deviceFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →