Inventor · disambiguated record
James Hayward
Also filed as: HAYWARD JAMES · HAYWARD JAMES L
9 granted patents·1 pending application·367 citations·filing 1987–2007
90Inventor score
Top patents by PatentIndex Score
10 records- 0190US6124546AIntegrated circuit chip package and method of making the sameADVANCED MICRO DEVICES INC·Filed 1997·Granted Sep 26, 2000·153 cites·17 claims
- 0286US4801999AIntegrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layersADVANCED MICRO DEVICES INC·Filed 1987·Granted Jan 31, 1989·76 cites·30 claims
- 0385US6936501B1Semiconductor component and method of manufactureADVANCED MICRO DEVICES INC·Filed 2004·Granted Aug 30, 2005·44 cites·20 claims
- 0483US7513035B2Method of integrated circuit packagingADVANCED MICRO DEVICES INC·Filed 2006·Granted Apr 7, 2009·13 cites·16 claims
- 0566US4916523AElectrical connections via unidirectional conductive elastomer for pin carrier outside lead bondADVANCED MICRO DEVICES INC·Filed 1988·Granted Apr 10, 1990·34 cites·3 claims
- 0661US8144478B1Circuit module and methodHAYWARD JAMES L·Filed 2005·Granted Mar 27, 2012·4 cites·15 claims
- 0758US8384210B1Thermal interface material and semiconductor component including the thermal interface materialADVANCED MICRO DEVICES INC·Filed 2005·Granted Feb 26, 2013·1 cites·9 claims
- 0855US6170407B1Folding leg mechanismSPEC FURNITURE INC·Filed 1999·Granted Jan 9, 2001·25 cites·11 claims
- 0954US5221005ARestraining device for tab carrier magazinesADVANCED MICRO DEVICES INC·Filed 1992·Granted Jun 22, 1993·17 cites·13 claims
- 1042US2009057884A1Multi-Chip PackageTOO SEAH SUN·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →