Inventor · disambiguated record
Janet Heyen
Also filed as: HEYEN JANET
1 granted patent·3 pending applications·1 citations·filing 2014–2015
16Inventor score
Top patents by PatentIndex Score
4 records- 0142US9999137B2Method for forming vias on printed circuit boardsINTRINSIQ MAT INC·Filed 2015·Granted Jun 12, 2018·1 cites·7 claims
- 0240US2014287159A1Conductive paste formulations for improving adhesion to plastic substratesINTRINSIQ MATERIALS INC·Filed 2014·Application pending·0 cites
- 0331US2015189761A1Method for depositing and curing nanoparticle-based inkINTRINSIQ MATERIALS INC·Filed 2014·Application pending·0 cites
- 0430US2014287158A1Performance of conductive copper paste using copper flakeINTRINSIQ MATERIALS INC·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →